The present invention discloses an elastic heat spreader for chip packaging, a packaging structure and a packaging method. The heat spreader includes a top cover plate and a side cover plate that extends outward along an edge of the top cover plate, wherein the top cover plate is configured to be placed on a chip, and at least a partial region of the side cover plate is an elastic member; and the elastic member at least enables the side cover plate to be telescopic in a direction perpendicular to the top cover plate. According to the present invention, a following problem is solved: delamination between the heat spreader and a substrate as well as the chip due to stress generated by different thermal expansion coefficients of the substrate, the heat spreader and the chip in a packaging process of a large-size product.

A spherical alumina powder, wherein D50 is 0.1 to 40 m; a circularity is 0.90 or more and 1.00 or less; an -phase percentage is 60% or more and 100% or less; and a particle surface roughness represented by Equation (1) below is 1.14 or more and 1.35 or less:

[00001]$\begin{array}{cc}\mathrm{Particle}\mathrm{surface}\mathrm{roughness}=\mathrm{BET}\mathrm{specific}\mathrm{surface}\mathrm{area}A/\mathrm{sphere}-\mathrm{equivalent}\mathrm{specific}\mathrm{surface}\mathrm{area}\mathrm{Sa}\mathrm{calculated}\mathrm{from}\mathrm{particle}\mathrm{size}\mathrm{distribution}.& \mathrm{Equation}\left(1\right)\end{array}$

A spherical alumina powder, wherein D50 is 0.1 to 40 m; a circularity is 0.90 or more and 1.00 or less; an -phase percentage is 60% or more and 100% or less; and a particle surface roughness represented by Equation (1) below is 1.14 or more and 1.35 or less:

[00001]$\begin{array}{cc}\mathrm{Particle}\mathrm{surface}\mathrm{roughness}=\mathrm{BET}\mathrm{specific}\mathrm{surface}\mathrm{area}A/\mathrm{sphere}-\mathrm{equivalent}\mathrm{specific}\mathrm{surface}\mathrm{area}\mathrm{Sa}\mathrm{calculated}\mathrm{from}\mathrm{particle}\mathrm{size}\mathrm{distribution}.& \mathrm{Equation}\left(1\right)\end{array}$

A ring structure on a package substrate is divided into at least four different components, including a plurality of first pieces and a plurality of second pieces. By dividing the ring structure into at least four different components, the ring structure reduces flexibility of the package substrate, which thus reduces stress on a molding compound (e.g., in a range from approximately 1% to approximately 10%). As a result, molding cracking is reduced, which reduces defect rates and increases yield. Accordingly, raw materials, power, and processing resources are conserved that would otherwise be consumed with manufacturing additional packages when defect rates are higher.

A method includes attaching a permeable plate to a metal lid, with the permeable plate including a metallic material, and dispensing a liquid-metal-comprising media to a first package component. The first package component is over and bonded to a second package component. The liquid-metal-comprising media includes a liquid metal therein. The method further includes attaching the metal lid to the second package component. During the attaching, the liquid-metal-comprising media migrates into the permeable plate to form a composite thermal interface material.

A semiconductor module includes: a mounting substrate including a mounting surface; a semiconductor element disposed on the mounting surface; a housing for the semiconductor element; a lid fixed to the housing and facing the mounting surface; an insulating sealing material disposed in a space inside the housing and sealing the semiconductor element; and a first adsorbent disposed between the lid and the insulating sealing material and is swollen by adsorption.