A semiconductor die and an electrically conductive ribbon are arranged on a substrate. The electrically conductive ribbon includes a roughened surface. An insulating encapsulation is molded onto the semiconductor die and the electrically conductive ribbon. The roughened surface of the electrically conductive ribbon provides a roughened coupling interface to the insulating encapsulation.

Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for forming a contact surface for an electrical conductor, wherein the shaped metal body is bent or folded. A method is also described for establishing electrical contacting of an electrical conductor on a semiconductor, said method including the steps of: fastening a bent or folded shaped metal body of a constant thickness to the semiconductor by means of a first fastening method and then fastening the electrical conductor to the shaped metal body by means of a second fastening method.

In the first aspect of the present disclosure, there is provided a method of manufacturing a semiconductor device, including the steps of: providing a substrate; mounting a semiconductor die having a first die surface and a second die surface opposite to the first die surface, with the first die surface mounted to the substrate; mounting a spacer having a first spacer surface and a second spacer surface opposite to the first spacer surface, with the first spacer surface mounted on the second die surface; fusing bonding to the second spacer surface by using ultrasonic fusing.