In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.

Embodiments herein describe an integrated circuit (IC) including an integrated circuit including a first die and a second die including an inductor and disposed over the first die, where the second die is electrically coupled to the first die via hybrid bonds (HBs). The IC may include a metal layer disposed under a portion of the inductor. The IC may further include a shielding layer disposed within the first die. The IC may also include first metal strips disposed adjacent a head section of the inductor and second metal strips disposed over a leg section of the inductor. The inductor may include a head section constructed as a dual loop and a leg section constructed as a pair of legs, where the inductor is enclosed within isolation walls.