Provided is a mounting apparatus including a mounting controller, which adjusts a position of a mounting tool such that a mounted surface of a mounting body is at a same height as an index surface of a calibration index, which is arranged to be imageable by an bottom-up imaging unit and an overhead imaging unit that adopts a Scheimpflug optical system, recognizes a reference position of the mounting body based on a bottom-up image output by causing the bottom-up imaging unit to image the mounting surface, adjusts a position of a stage such that a mounting surface of a planned placement region is at the same height as the index surface, and mounts the mounting surface on the mounted surface based on the recognized reference position.

The present invention relates to a high-precision substrate alignment method and system for semiconductor bonding, utilizing advanced sensory systems, digital twin technology, and machine learning. Unique alignment marks, such as 2D barcodes and varied critical dimension (CD) grids, capture precise positional information of substrates in 3D space. This system optimizes movement trajectories for substrate bonding, significantly improving alignment accuracy and process efficiency.