A curable composition capable of being cured at a low temperature of from room temperature to 150 C. is provided. The curable composition comprises a fluorinated polymer containing at least three functional groups represented by the following formula (F) and at least one curing agent selected from the group consisting of an isocyanate-type curing agent, a blocked isocyanate-type curing agent and an amino resin-type curing agent:
R.sup.f1COZ.sup.1(F)
(in the formula (1), R.sup.f1 is a fluoroalkylene group, or a fluoroalkylene group with at least two carbon atoms having an etheric oxygen atom between carbon-carbon atoms, Z.sup.1 is NR.sup.1NR.sup.2H or NR.sup.3OR.sup.4, and R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each independently a hydrogen atom or an alkyl group.)

A mechanochromic system comprising a first inorganic/polymer composite layer; and a first elastomer layer bonded to the composite layer to form a composite/elastomer assembly, methods of making, and methods of use thereof are provided.

A mechanochromic system comprising a first inorganic/polymer composite layer; and a first elastomer layer bonded to the composite layer to form a composite/elastomer assembly, methods of making, and methods of use thereof are provided.

The present invention relates to a photocatalytic coating film composition and method for producing thereof. More specifically, it relates to an acidic anti-mould and anti-fungal photocatalytic coating film formed by the decomposition and evaporation of the volatile organic base from the photocatalytic coating composition after the application and the drying on substrate. The photocatalytic coating liquid composition consisting of a strong acidic nature of Nafion with pH<2 as an indispensable binder resin; a volatile organic base to neutralize the acidic binder resin temporarily and photocatalysts to generate strong oxidizing compounds which decompose harmful organic compounds and also to provide protection for the acidic environment by decomposing neutralizing chemicals from outside.

A low stress moisture resistant structure of semiconductor device comprises a low stress moisture resistant layer, wherein a semiconductor device is formed on a semiconductor wafer, the semiconductor device comprises at least one pad, the low stress moisture resistant layer is coated on the semiconductor device and the semiconductor wafer so that a pad top center surface of the pad is exposed. The low stress moisture resistant layer comprises a material comprising crosslinked fluoropolymer. A before-coated stress measured on the semiconductor wafer before the low stress moisture resistant layer is coated and an after-cured stress measured on the semiconductor wafer after the low stress moisture resistant layer is coated and cured define a stress difference, the stress difference is greater than or equal to 510.sup.7 dyne/cm.sup.2 and less than or equal to 510.sup.7 dyne/cm.sup.2.

A low stress moisture resistant structure of semiconductor device comprises a low stress moisture resistant layer, wherein a semiconductor device is formed on a semiconductor wafer, the semiconductor device comprises at least one pad, the low stress moisture resistant layer is coated on the semiconductor device and the semiconductor wafer so that a pad top center surface of the pad is exposed. The low stress moisture resistant layer comprises a material comprising crosslinked fluoropolymer. A before-coated stress measured on the semiconductor wafer before the low stress moisture resistant layer is coated and an after-cured stress measured on the semiconductor wafer after the low stress moisture resistant layer is coated and cured define a stress difference, the stress difference is greater than or equal to 510.sup.7 dyne/cm.sup.2 and less than or equal to 510.sup.7 dyne/cm.sup.2.

To provide a dispersion excellent in miscibility with varnish, coating properties, dispersibility and dispersion stability; and methods for producing a metal laminate and a printed board. A dispersion comprises an organic solvent and a powder so that the powder is dispersed in the organic solvent, wherein the powder is a powder containing a tetrafluoroethylene type polymer having a melt viscosity at 380 C. of from 110.sup.2 to 110.sup.6 Pa.Math.s; the viscosity is from 50 to 10,000 mPa.Math.s; and the thixotropy ratio calculated by dividing the viscosity measured under the condition of rotational speed of 30 rpm by the viscosity measured under the condition of rotational speed of 60 rpm, is from 1.0 to 2.2.

A process is provided for the polymerization of fluoromonomer to an dispersion of fluoropolymer particles in an aqueous medium in a polymerization reactor, by (a) providing the aqueous medium in the reactor, (b) adding the fluoromonomer to the reactor, (c) adding initiator to the aqueous medium, the combination of steps (b) and (c) being carried out essentially free of hydrocarbon-containing surfactant and resulting in the kickoff of the polymerization of the fluoromonomer, and (d) metering hydrocarbon-containing surfactant into the aqueous medium after the kickoff of polymerization, e.g. after the concentration of the fluoropolymer in the aqueous medium is at least 0.6 wt %, the metering being at a rate reducing the telogenic activity of said surfactant while maintaining surface activity.

A process is provided for the polymerization of fluoromonomer to an dispersion of fluoropolymer particles in an aqueous medium in a polymerization reactor, by (a) providing the aqueous medium in the reactor, (b) adding the fluoromonomer to the reactor, (c) adding initiator to the aqueous medium, the combination of steps (b) and (c) being carried out essentially free of hydrocarbon-containing surfactant and resulting in the kickoff of the polymerization of the fluoromonomer, and (d) metering hydrocarbon-containing surfactant into the aqueous medium after the kickoff of polymerization, e.g. after the concentration of the fluoropolymer in the aqueous medium is at least 0.6 wt %, the metering being at a rate reducing the telogenic activity of said surfactant while maintaining surface activity.

A process is provided for the polymerization of fluoromonomer to an dispersion of fluoropolymer particles in an aqueous medium in a polymerization reactor, by (a) providing the aqueous medium in the reactor, (b) adding the fluoromonomer to the reactor, (c) adding initiator to the aqueous medium, the combination of steps (b) and (c) being carried out essentially free of hydrocarbon-containing surfactant and resulting in the kickoff of the polymerization of the fluoromonomer, and (d) metering hydrocarbon-containing surfactant into the aqueous medium after the kickoff of polymerization, e.g. after the concentration of the fluoropolymer in the aqueous medium is at least 0.6 wt %, the metering being at a rate reducing the telogenic activity of said surfactant while maintaining surface activity.