In a copper alloy bonding wire for semiconductor devices, the bonding longevity of a ball bonded part under high-temperature and high-humidity environments is improved. The copper alloy bonding wire for semiconductor devices includes in total 0.03% by mass or more to 3% by mass or less of at least one or more kinds of elements selected from Ni, Zn, Ga, Ge, Rh, In, Ir, and Pt (first element), with the balance Cu and inevitable impurities. The inclusion of a predetermined amount of the first element suppresses production of an intermetallic compound susceptible to corrosion under high-temperature and high-humidity environments at the wire bonding interface and improves the bonding longevity of a ball bonded part.

In a copper alloy bonding wire for semiconductor devices, the bonding longevity of a ball bonded part under high-temperature and high-humidity environments is improved. The copper alloy bonding wire for semiconductor devices includes in total 0.03% by mass or more to 3% by mass or less of at least one or more kinds of elements selected from Ni, Zn, Ga, Ge, Rh, In, Ir, and Pt (first element), with the balance Cu and inevitable impurities. The inclusion of a predetermined amount of the first element suppresses production of an intermetallic compound susceptible to corrosion under high-temperature and high-humidity environments at the wire bonding interface and improves the bonding longevity of a ball bonded part.

Disclosed is a high-strength free-cutting leadless copper alloy with excellent machinability and corrosion-resistance. The free-cutting leadless copper alloy contains 58 to 70 wt % of copper (Cu), 0.5 to 2.0 wt % of tin (Sn), 0.1 to 2.0 wt % of silicon (Si), a balance amount of zinc (Zn), and inevitable impurities but does not contain lead.

Disclosed is a high-strength free-cutting leadless copper alloy with excellent machinability and corrosion-resistance. The free-cutting leadless copper alloy contains 58 to 70 wt % of copper (Cu), 0.5 to 2.0 wt % of tin (Sn), 0.1 to 2.0 wt % of silicon (Si), a balance amount of zinc (Zn), and inevitable impurities but does not contain lead.

The present invention provides a surface treatment method that improves antimicrobial activity of copper or a copper alloy and enhances immediate effects of antimicrobial actions on the surface of the copper or the copper alloy. A surface treatment method for copper or a copper alloy according to the present invention comprises preparing a reducing agent solution containing a biological reducing substance, and treating the surface of the copper or the copper alloy with the reducing agent solution. The present invention also provides a surface treatment liquid for sterilizing copper or a copper alloy, in which the surface treatment liquid contains a biological reducing substance. The present invention also provides a sterilization method that comprises bringing copper or a copper alloy treated by the surface treatment method into contact with a surface of an object to sterilize the surface of the object.

The present invention provides a surface treatment method that improves antimicrobial activity of copper or a copper alloy and enhances immediate effects of antimicrobial actions on the surface of the copper or the copper alloy. A surface treatment method for copper or a copper alloy according to the present invention comprises preparing a reducing agent solution containing a biological reducing substance, and treating the surface of the copper or the copper alloy with the reducing agent solution. The present invention also provides a surface treatment liquid for sterilizing copper or a copper alloy, in which the surface treatment liquid contains a biological reducing substance. The present invention also provides a sterilization method that comprises bringing copper or a copper alloy treated by the surface treatment method into contact with a surface of an object to sterilize the surface of the object.

A vehicle interior material made of a rose-gold-colored copper alloy may include 0.07 to 0.21 wt % of aluminum (Al), 0.06 to 0.19 wt % of magnesium (Mg), 0.17 to 0.52 wt % of zinc (Zn), and a balance of copper (Cu) and unavoidable impurities, wherein the sum of the aluminum (Al), the magnesium (Mg), and the zinc (Zn) is 0.5 to 1.5 at %.

A vehicle interior material made of a rose-gold-colored copper alloy may include 0.07 to 0.21 wt % of aluminum (Al), 0.06 to 0.19 wt % of magnesium (Mg), 0.17 to 0.52 wt % of zinc (Zn), and a balance of copper (Cu) and unavoidable impurities, wherein the sum of the aluminum (Al), the magnesium (Mg), and the zinc (Zn) is 0.5 to 1.5 at %.

Physical vapor deposition target assemblies and methods of manufacturing such target assemblies are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of arcs and bends fluidly connected to an inlet end and an outlet end.

Physical vapor deposition target assemblies and methods of manufacturing such target assemblies are disclosed. An exemplary target assembly comprises a flow pattern including a plurality of arcs and bends fluidly connected to an inlet end and an outlet end.