A semiconductor manufacturing apparatus includes a flux container defining an accommodation space, the accommodation space configured to accommodate flux, a head tool configured to pick up and position a semiconductor device, semiconductor device including a connection terminal, and a vibration generator configured to apply vibrations to the flux container.

A wire bonding apparatus may include a wire supply portion configured to supply a conductive wire, a capillary configured to draw out the conductive wire supplied from the wire supply portion, and a wire holder disposed between the capillary and the wire supply portion. The wire holder has a first clamp and a second clamp that are spaced apart from each other and are configured to clamp the conductive wire. Each of the first clamp and the second clamp has a polygonal column shaped support body having with a plurality of contact surfaces along a circumference of each of the first clamp and the second clamp, and the polygonal column shaped support body is configured to rotate in a circumferential direction about a central axis of the polygonal column shaped support body.

A solder reflow system may include a solder reflow apparatus, a condensation apparatus and a cleaning apparatus. The solder reflow apparatus may be configured to reflow a solder of a semiconductor package using a heat transfer fluid. The condensation apparatus may be configured to receive the semiconductor package processed by the solder reflow apparatus. The condensation apparatus may condensate a gas generated from the heat transfer fluid to convert the gas into a liquid. The cleaning apparatus may be configured to clean the semiconductor package processed by the condensation apparatus using a cleaning agent. Thus, the heat transfer fluid stained with the semiconductor package may be removed by the condensation apparatus so that the heat transfer fluid may not be introduced into the cleaning apparatus. As a result, the heat transfer fluid may not be mixed with the cleaning agent to maintain cleaning capacity of the cleaning agent.

An electronic component mounting device (1) comprises: an electronic component supply unit (20) that supplies an electronic component having a bump electrode (EB); a transfer stage (31) that accumulates a flux (FX); a mounting stage (41) on which a substrate (BD) is placed; a plurality of heads that can each pick up an electronic component (CP); and a control unit (10) that controls movement of the plurality of heads. The control unit (10) is configured so as to cause each of the plurality of heads to function as a dipping head that dips the bump electrode (EB) of the electronic component (CP) into the flux (FX) accumulated on the transfer stage (31), or as a bonding head that mounts the electronic component (CP) to the substrate (BD) on the mounting stage (41) with the bump electrode (EB) interposed therebetween.