Provided is a semiconductor device with a configuration capable of ensuring insulation properties between terminals having different potentials and arranged with an insulating layer interposed. The semiconductor device includes: a first terminal; a second terminal having a part opposed to the first terminal and another part provided with a first opening not opposed to the first terminal; and an insulating layer including a body part interposed between the first terminal and the second terminal opposed to each other and a first protrusion connected to the body part and inserted to the first opening.

An interconnection clip for a semiconductor package and semiconductor device or package comprising the same. The clip comprises a first metal and a second metal, wherein the first metal is copper and the second metal is tungsten or molybdenum; and one or more cavities provided on a first side of the clip, wherein the first side of the clip is configured for attachment to a die top of the semiconductor package.