A heat dissipating member includes: a sintered material portion containing copper and at least one of tungsten and molybdenum; and a plurality of silicon oxide particles dispersed in the sintered material portion. The heat dissipating member has a copper content of M.sub.Cu weight percent, a tungsten content of M.sub.W weight percent, a molybdenum content of M.sub.Mo weight percent, and a silicon oxide content of M.sub.SiO2 weight percent in terms of SiO.sub.2 equivalent, relative to a total weight of copper, tungsten, and molybdenum. The heat dissipating member satisfies: 0.9M.sub.Cu/(M.sub.Cu+M.sub.W+M.sub.Mo)0.045; and 0.01M.sub.SiO2/(M.sub.Cu+M.sub.W+M.sub.Mo)0.0003.