Process for the production of a timepiece provided with a hollow or raised external element

Abstract

A process for producing a part provided with an external element includes: providing an electrically conductive substrate having an upper surface and a raised pattern with a crest on the upper surface; depositing an electrically insulating layer onto the upper surface around the pattern to a thickness less than or equal to the distance between the crest and the upper surface; depositing a metal layer onto the crest by galvanic growth so that the metal layer partly rests on the insulating layer; dissolving the insulating layer; covering an assembly including the substrate and the metal layer with a mass of a base material of the part to form an imprint; separating the mass and the metal layer from the substrate, the mass then exhibiting an external element formed by a recess, the shape of which corresponds to the imprint and the base of which interfaces with the metal layer.

Claims

1. A process for producing a part provided with an external element, the process comprising: providing an electrically conductive substrate having an upper surface; depositing an electrically insulating layer onto the upper surface of the substrate; machining the insulating layer and the substrate so that a hollow pattern is formed that passes through the insulating layer and extends over a portion of the substrate; depositing a metal layer into the pattern by galvanic growth so that, at the end of the depositing the metal layer, the metal layer partly rests on the insulating layer; dissolve the insulating layer; covering an assembly comprising the substrate and the metal layer with a mass of a base material of the part, wherein the mass forms an imprint of the assembly; separating the mass and the metal layer from the substrate, wherein the metal layer then forms an outgrowth forming an external element on the mass, the shape of the outgrowth corresponding to an imprint of the pattern.

2. The production process according to claim 1, further comprising: dissolving the metal layer, wherein the mass then has a cavity comprising anchoring arms formed by an imprint of the metal layer.

3. The production process according to claim 2, further comprising, following the dissolving the metal layer: filling the cavity with a compound.

4. The production process according to claim 3, wherein the compound is a resin, a lacquer or a metal.

5. The production process according to claim 3, wherein the base material of the mass is not metallic, the compound is metallic, and the process includes, between the steps of the dissolving the metal layer and the filling the cavity with the compound: depositing a metal film on the walls of the cavity by a physical vapour deposition process, and wherein the filling is conducted by galvanic growth of the compound on the metal film.

6. The production process according to claim 2, further comprising: inserting a mineral, for example a diamond, into the cavity by means of a track opening into the cavity, wherein the mineral is then held in the cavity at the level of the anchoring arms.

7. The production process according to claim 6, wherein the mineral is a diamond.

8. The production process according to claim 1, further comprising, before the depositing the insulating layer: machining the upper surface of the substrate so as to create a texture.

9. The production process according to claim 8, where the texture is an engraving.

10. The production process according to claim 1, further comprising, after the depositing the metal layer: machining the metal layer so as to reduce at least one of its dimensions and/or structure at least one of its surfaces.

11. The production process according to claim 1, wherein the base material is a metal or an amorphous or partly amorphous metal alloy or a polymer, and the covering is performed by pressing a block of base material onto the assembly comprising the substrate and the metal layer.

12. The production process according to claim 1, wherein the base material is metallic and the covering is performed by galvanic growth of the base material on the assembly comprising the substrate and the metal layer.

13. The production process according to claim 1, wherein the metal layer is formed from gold, silver, nickel or an alloy of the aforementioned metals.

14. The production process according to claim 1, wherein the insulating layer is formed from resin.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Other special features and advantages will become clear from the following non-restrictive description provided as an example with reference to the attached drawings, wherein:

(2) FIGS. 1a to 1g are schematic representations of steps of the process for the production of a part provided with an external element according to a first embodiment of the invention

(3) FIGS. 2a to 2f are schematic representations of steps of the process for the production of a part provided with an external element according to a second embodiment of the invention

(4) FIGS. 3a to 3c are schematic representations of additional steps of the process according to the first or the second embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(5) According to a first embodiment illustrated in FIGS. 1a to 1g the process according to the invention comprises the following steps.

(6) According to a step Md_Sub shown in FIG. 1a, an electrically conductive substrate SB, also called a master in the field of moulding, is provided. The substrate SB is advantageously formed from brass, but can be formed from another material, e.g. stainless steel, aluminium, nickel, a cermet composite, a ceramic or a polymer that has been rendered conductive (by electroplating or plasma treatment, for example) etc. Moreover, the substrate SB has a pattern MT forming a relief or projection from an upper surface SP of the substrate SB. In one embodiment the pattern MT has been obtained by machining the substrate SB. In another embodiment the pattern has not been obtained by machining, but by injection or by hot-pressing a partially or totally amorphous metal alloy based on zirconium or platinum, for example.

(7) In the example of FIG. 1a the pattern MT has a flat crest ST extending parallel to the upper surface SP of the substrate SB and flanks FC extending substantially orthogonally to said crest ST. This form is not restrictive; the flanks FC could be inclined in relation to the upper surface SP at an angle α less than 90°, the crest ST could be not completely parallel to the upper surface SP etc. It is noted that the upper surface SP and the crest ST have possibly undergone a surface machining operation to create a particular texture that is desired for the part, e.g. an engraving, as can be seen in FIG. 1a.

(8) According to a step Md_Cis shown in FIG. 1b an insulating layer CI, advantageously a resin, is deposited onto the upper surface SP to a thickness E less than or equal to the height H of the pattern MT. The depositing step Md_Cis is performed, for example, by stoving a resin in viscous form deposited around the pattern MT. In practice, if the insulating layer CI is deposited to a thickness E that causes the insulating layer CI to extend beyond the crest ST of the pattern MT, the excess is removed by surface treatment. This surface treatment may also enable a texture to be created or recreated at the level of the crest SP.

(9) According to a step Md_Cga shown in FIG. 1c a metal layer CM is deposited onto the (electrically conductive) crest ST of the pattern MT by galvanic growth. The substrate SB topped by the insulating layer CI is thus dipped into a galvanic bath suitable for the deposition of a metal such as gold, silver, nickel or any other metal or metal alloy that can be deposited in a relatively thick layer. Because of the configuration of the insulating layer CI on the substrate SB, the metal deposit grows not only orthogonally to the crest ST, but also laterally, i.e. in the direction of the insulating layer CI. At the end of step Md_Cga the metal layer CM thus has lateral ends EL that rest on the insulating layer CI.

(10) According to an optional step the metal layer CM is machined to reduce its thickness P and/or structure or polish its surface.

(11) According to a step Md_Dis shown in FIG. 1d the insulating layer CI is dissolved. Thus, all that remains is an assembly ES formed from the substrate SB and the metal layer CM.

(12) According to an optional step, a surface treatment of this assembly ES is conducted. This treatment is the application of a parting agent or a passivation treatment, for example. The significance of this step will be seen in the following text.

(13) In a step Md_Enr shown in FIG. 1e this assembly ES is covered with a mass VL of a base material of the part to be produced so that the mass VL forms an imprint of the assembly ES. In one embodiment the base material consists of amorphous or partly amorphous metal, which is of interest because of its mechanical properties. In another embodiment the base material is a polymer. In these two cases a block of metal or of amorphous or partly amorphous metal alloy or polymer is pressed onto the assembly ES at a temperature, at which it has a paste-like consistency, which enables it to deform to mould to the shapes of the assembly ES, and in particular to the shapes of lateral ends EL of the metal layer CM. In another embodiment the base material is any other metal or metal alloy, e.g. nickel, gold etc., and the covering is conducted by galvanic growth of said metal. It is noted that at the end of step Md_Enr the metal layer CM is fixed to the mass VL of base material, since its lateral ends EL form hooks sealed into the mass VL of base material.

(14) According to a step Md_Dem shown in FIG. 1f the mass VL of base material and the metal layer CM are separated from the substrate SB. To achieve this, the substrate SB is dipped into a selective acid bath, for example, in which it is dissolved. Alternatively, the separation is achieved by forcible demoulding. Demoulding is thus facilitated if the assembly ES has been surface treated beforehand.

(15) At the end of step Md_Dem the mass VL of base material has a recess EV that corresponds in shape to the imprint of the pattern MT of the substrate SB, the base FD of which is the colour of the metal layer CM. It is noted that the transition between the mass VL of base material and the metal layer CM is clean. Moreover, as a result of imprints the mass VL has a textured appearance: the base FD of the recess EV has a mirror appearance similar to that of the crest ST of the substrate SB, and the surface SF of the mass VL that was previously facing the upper surface SP of the substrate SB has a mirror appearance similar to that of said upper surface SP.

(16) It is noted that FIG. 1f shows the substrate SB and the metal layer CM as they are when in step Md_Cis the insulating layer CI is deposited to a thickness E approximately equal to the height H of the pattern MT. The lateral ends EL of the metal layer CM then extend parallel to the base FD of the recess EV. In contrast, FIG. 1g shows the mass VL and the metal layer CM as they are when in step Md_Cis the insulating layer CI is deposited to a thickness E that is less than the height H of the pattern MT. The lateral ends EL of the metal layer CM then extend over a portion of the side walls PL of the recess EV.

(17) The first embodiment thus allows production of a part PC provided with an enclosed external element. This external element is formed from a recess EV having a base FD with the colour of the metal layer CM, e.g. golden or silver. Moreover, the interface between the mass VL and the metal layer CM is clean without burrs. In addition, the metal layer CM is inseparable from the rest of the part. Finally, the surface SF of the part PC and the base FD of the recess EV are textured.

(18) According to a second embodiment illustrated in FIGS. 2a to 2f the process according to the invention comprises the following steps.

(19) According to one step a conductive substrate SB′ is provided. The substrate SB′ is advantageously made from brass, but can be made from another material, e.g. stainless steel, aluminium, nickel etc. The upper surface SP′ of the substrate SB′ may possibly have been subjected to a surface machining operation to create a particular texture that is desired for the part, e.g. an engraving, as is evident from FIG. 2a.

(20) According to a step Md′_Cis shown in FIG. 2a an insulating intermediate layer CI′, advantageously a resin, with a thickness E′ is deposited onto the upper surface SP′ of the substrate SB′. The depositing step Md′_Cis is conducted, for example, by stoving a resin in viscous form deposited onto the upper surface SP′.

(21) According to a step Md′_Uge shown in FIG. 2b the insulating layer CI′ and the substrate SB′ are machined in order to produce a hollow pattern MT′ that extends through the insulating layer CI′ and over a portion of the substrate SB′ with thickness G. In the example of FIG. 2b the pattern MT′ has a flat base ST′, which extends parallel to the upper surface SP′ of the substrate SB′, and flanks FC′, which extend approximately orthogonally to said base ST′, but this form is not restrictive. The flanks FC′ could be inclined in relation to the upper surface SP′ at an angle α′ less than 90°, the base ST′ could be not completely parallel to the upper surface SP′ etc.

(22) According to a step Md′_Cga shown in FIG. 2c a metal layer CM′ is deposited into the pattern MT′ by galvanic growth. The substrate SB′ with the insulating layer CI′ on top of it is thus dipped into a galvanic bath suitable for the deposition of a metal such as gold, silver, nickel or any other metal or metal alloy that can be deposited in a relatively thick layer. When the pattern MT′ is completely filled with metal deposit, the metal deposit grows not only orthogonally to the base ST′ of the pattern MT′, but also laterally in order to be deposited on the insulating layer CI′. At the end of the step Md′_Cga the metal layer CM′ thus has lateral ends EL′, which rest on the insulating layer CI′.

(23) According to an optional step the metal layer CM′ is machined to reduce the thickness P′ of the lateral ends EL′ and/or structure or polish the surface of the metal layer CM′.

(24) According to a step Md′_Dis shown in FIG. 2d the insulating layer CI′ is dissolved. Thus, all that remains is an assembly ES′ formed from the substrate SB′ and the metal layer CM′.

(25) According to an optional step a surface treatment of this assembly ES′ is conducted. This treatment is the application of an oil or a passivation, for example. The significance of this step will be seen in the following text.

(26) In a step Md′_Enr shown in FIG. 2e this assembly ES′ is covered with a mass VL′ of a base material of the part to be produced so that the mass VL forms an imprint of the assembly ES. In one embodiment the base material consists of metal or an amorphous or partly amorphous metal alloy. In another embodiment the base material is a polymer. In these two cases a block of amorphous or partly amorphous metal or polymer is pressed onto the assembly ES′ at a temperature, at which it has a paste-like consistency, which enables it to deform to mould to the shapes of the assembly ES′, and in particular the shapes of the lateral ends EL′ of the metal layer CM′. In another embodiment the base material is any other metal, e.g. nickel, gold etc., and the covering is conducted by galvanic growth of said metal. It is noted that at the end of step Md′_Enr the metal layer CM′ is fixed to the mass VL′ of base material because its lateral ends EL′ form hooks sealed into the mass VL′ of base material.

(27) According to a step Md′_Dem shown in FIG. 2f the substrate SB′, the mass VL′ of base material and the metal layer CM′ are separated. To achieve this, the substrate SB′ is dipped into a selective acid bath, for example, in which it is dissolved. Alternatively, the separation is achieved by forcible demoulding. Demoulding is thus facilitated if the assembly ES′ has been surface treated beforehand.

(28) At the end of step Md′_Dem the metal layer CM′ forms an outgrowth EV′ on the mass VL′ that corresponds in shape to the imprint of the pattern MT′ in the substrate SB′. It is noted that the transition between mass VL′ of base material and the metal layer CM′ is clean. Moreover, as a result of imprints the mass VL′ has a textured appearance: the surface SF′ of the mass VL′ that was previously facing the upper surface SP′ of the substrate SB′ has a mirror appearance similar to that of said upper surface SP′.

(29) Thus, the second embodiment enables a part PC′ provided with a raised external element to be produced. This external element consists of an outgrowth EV′ formed by the metal layer CM′. Moreover, the interface between the mass VL′ and the metal layer CM′ is clean without burrs. In addition, the metal layer CM′ is inseparable from the rest of the part. Finally, the surface SF′ of the part PC can be textured.

(30) Moreover, the process according to the first or the second embodiment possibly includes the following additional steps that enable the appearance of the external element to be modified.

(31) According to an optional step Md_Ddr shown in FIG. 3a the metal layer CM, CM′ is chemically dissolved. The mass VL, VL′ then has a cavity CV comprising anchoring arms BA formed by imprint of the lateral ends EL, EL′ of the metal layer CM, CM′. The geometry of the cavity CV depends on several parameters: the width L, L′ of the pattern MT, MT′ shown in FIGS. 1a and 2b the height H, E′+G of the pattern MT, MT′ shown in FIGS. 1b and 2b the inclination α, α′ of the flanks FC, FC′ of the pattern MT, MT′ shown in FIGS. 1a and 2b the width G, G′ of the lateral ends EL, EL′ of the metal layer CM, CM′ shown in FIGS. 1c and 2c the thickness P, P′ of said lateral ends EL, EL′ of the metal layer CM, CM′ (which is equal to their width G, G′ unless the metal layer CM, CM′ has been machined) shown in FIGS. 1c and 2c the thickness E, E′ of the insulating layer CI, CI′ deposited in step Md_Cis or Md′_Cis shown in FIGS. 1b and 2b.

(32) The anchoring arms BA are advantageously used to hold an element such as a coloured resin, a fluorescent lacquer, a metal, a mineral etc. in place.

(33) Hence, in an embodiment the process includes a step Md_Rsl, shown in FIG. 3b, for partially or completely filling the cavity CV with resin or lacquer RL, which may be coloured or fluorescent. The resin or lacquer RL is inserted, for example, in a paste-like form, then stoved to be solidified. Because of the anchoring arms BA it is then impossible to separate the resin or lacquer RL from the mass VL, VL′.

(34) In an alternative embodiment the process includes a step of inserting a metal, a metal alloy or a composite into the cavity CV. The metal is inserted in liquid form, for example, then cooled to be solidified. Because of the anchoring arms it is then impossible to separate the metal from the mass VL, VL′. Alternatively, the metal can be deposited by galvanic growth. In this case, if the base material forming the mass VL, VL′ is not metallic, it is necessary to perform a step of depositing at least one thin metal film into the cavity CV by physical vapour deposition beforehand.

(35) In an alternative embodiment the process includes a step Md_Min, shown in FIG. 3c, for setting a mineral MN, e.g. a diamond, in the cavity. The mineral MN then has a base with notches EC on top and said notches EC cooperate with a track leading to the cavity CV. When the mineral MN is in the cavity CV, it is held there by the anchoring arms BA. It is noted that in this case it is advantageous that the side walls PL of the cavity CV form a sharp angle with the anchoring arms BA, as can be seen in FIG. 3c, so that the side walls PL are fitted into the notches EC. This corresponds to a pattern MT, MT′ in which the flanks FC, FC′ have a low angle of inclination α, α′.

(36) Of course, the present invention is not limited to the illustrated example, but is open to various variants and modifications that will occur to the person skilled in the art.