SURFACE COVERINGS

Abstract

The invention provides a sensor surface-covering material sensor surface-covering material comprising a layer of synthetic material and a sensor layer which detects a change in an electrical property wherein the sensor layer comprises at least one electrically conductive layer and wherein the electrical property is resistance and/or capacitance; and a sensor surface-covering system comprising a sensor surface-covering material according to the invention and an electrical component housing for processing a signal generated by the sensor material.

Claims

1. A sensor surface-covering material comprising a layer of synthetic material and a sensor layer which detects a change in an electrical property which is resistance and/or capacitance.

2. A surface-covering material as defined in claim 1 wherein the sensor layer detects contact with a conductive object and/or proximity of a conductive object.

3. A surface-covering material as defined in claim 1 wherein the sensor layer comprises one or more conductive elements provided on a layer of synthetic material.

4. A surface-covering material as defined in claim 1 wherein the sensor layer comprises a detectable mechanical-property sensor layer which detects a change in a mechanical property.

5. A surface-covering material as defined in claim 4 wherein the detectable mechanical-property sensor layer detects the application of applied mechanical stress by an object by vibration of the sensor material and/or by deformation of the sensor material.

6. A surface-covering material as defined in claim 4 wherein the sensor layer comprises an upper electrically conductive layer which in use is positioned above a sensor material layer which is a detectable mechanical-property sensor layer and a lower electrically conductive layer which in use is positioned below the sensor material layer.

7. A surface-covering material as defined in claim 1 wherein the sensor layer comprises a sensor array comprising a plurality of sensors.

8. A surface-covering material as defined in claim 1 wherein the sensor layer comprises an electrical-property sensor which comprises one or more conductive element sensor and/or one or more capacitor sensors.

9. A surface-covering material as defined in claim 1 wherein the sensor layer comprises a detectable mechanical-property sensor which comprises an electroactive polymer, an electret, a piezoelectric material, a carbon nanotube/polymer blend, a piezoresistive material and/or a force sensing resistor.

10. A surface-covering material as in claim 1 wherein the sensor layer comprises a detectable mechanical-property sensor and wherein the surface-covering material comprises a deflection aid to increase movement of the detectable mechanical-property sensor.

11. A surface-covering material as defined in claim 1 wherein the sensor layer comprises a protective layer.

12. A surface-covering material as defined in claim 1 wherein the surface-covering material is a wall-covering material, a floor-covering material or an underlay for placing under conventional flooring material.

13. A surface-covering material as defined in claim 12 wherein the flooring material comprises a support structure.

14. A surface-covering material as defined in claim 1 which comprises a plurality of different regions comprising at least a sensor region where the surface-covering material comprises a sensor layer and a non-sensing region where the sensor layer has been replaced by a spacer layer wherein the spacer layer is formed from a synthetic material.

15. A surface-covering material as defined in claim 14 wherein the surface-covering material comprises a signalling region where the sensor layer has been replaced by a signalling layer which comprises at least one conductive layer.

16. A surface-covering material as defined in claim 1 wherein at least one layer of the sensor layer comprises a printable material.

17. A sensor surface-covering system comprising a sensor surface-covering material comprising a layer of synthetic material and a sensor layer which detects a change in an electrical property which is resistance and/or capacitance and an electrical component housing for processing a signal generated by the sensor layer.

18. A sensor surface-covering system as defined in claim 17 wherein the housing comprises a signal processor which is programmed to differentiate different types of sensor layer signal data so as to determine the proximity or location of an object, the type of object and/or behaviour of the object.

Description

[0049] The invention will now be described with reference to the following Figures of the accompanying drawings which are not intended to limit the scope of the invention in which:

[0050] FIG. 1 shows a schematic cross-section of a first embodiment of a sensor flooring material according to the invention;

[0051] FIG. 2 shows a schematic cross-section of a second embodiment of a sensor flooring material according to the invention;

[0052] FIG. 3 shows a schematic cross-section of a third embodiment of a sensor flooring material according to the invention;

[0053] FIG. 4 shows a schematic cross-section of a fourth embodiment of a sensor flooring material according to the invention;

[0054] FIG. 5 shows a schematic cross-section of a fifth embodiment of a sensor flooring material according to the invention which is in the form of a sensor underlay according to the invention and a decorative floor covering having a profiled base layer;

[0055] FIG. 6 shows a schematic underneath plan view of the sensor underlay of the fifth embodiment of a sensor flooring material according to the invention;

[0056] FIGS. 7A, 7B, 7C and 7D respectively show schematic cross-sections of first, second, third and fourth embodiments of a sensor layer for use in a sensor flooring material according to the invention;

[0057] FIGS. 8A and 8B respectively show schematic plan views of first and second embodiments of a signalling array for use in a sensor flooring material according to the invention;

[0058] FIG. 9 shows a schematic cross-section of a signalling layer for use in a sensor flooring material according to the invention;

[0059] FIG. 10 shows a schematic cross-section of a spacer layer for use in a sensor flooring material according to the invention;

[0060] FIG. 11 shows an overhead plan view of a first embodiment of a sensor flooring system according to the invention;

[0061] FIG. 12 shows a schematic plan view of a fifth embodiment of a sensor layer for use in the invention;

[0062] FIG. 13 shows a schematic plan view of a sixth embodiment of a sensor layer for use in the invention;

[0063] FIG. 14 shows a schematic cross-sectional view of a seventh embodiment of a sensor layer for use in the invention;

[0064] FIG. 15 shows a schematic cross-sectional view of an eighth embodiment of a sensor layer for use in the invention; and

[0065] FIG. 16 shows a schematic cross-sectional view of a seventh embodiment of a sensor surface-covering material according to the invention.

[0066] The first embodiment of a sensor surface-covering material in the form of a sensor flooring material indicated generally at 100 is illustrated in FIG. 1. Sensor flooring material 100 has three layers laminated or adhered together. A first layer is a sensor layer 130 comprising one or more printed layers of a piezoelectric material. The sensor layer 130 is laminated on the lower side of a substrate base layer 110 which is a cellulose/polyester support reinforced with a 32 tex glass crennette. On top of the substrate layer 110 there is an overcoat layer 140 which is formed from a plastics material. Sensor layer 130 is a detectable mechanical-property sensor layer as it is capable of detecting a change in a mechanical property.

[0067] As an alternative to the embodiment depicted in FIG. 1, the sensor flooring material 100 may omit a substrate layer 110. In a further alternative embodiment, the sensor flooring material may have an undercoat layer arranged between the substrate layer 110 and the overcoat layer 140. In an alternative embodiment, the undercoat layer may be a foamed layer which is capable of imparting a sound attenuation effect, for example an acoustic impact sound reduction of 12, 13, 14 or 15 dB. In a further alternate embodiment, sensor layer 130 may be replaced by the second, third, fourth, fifth, sixth, seventh or eighth embodiment of the sensor layer 230,330,430,530,630,730,830.

[0068] The second embodiment of a sensor surface-covering material in the form of a sensor flooring material indicated generally at 200 is illustrated in FIG. 2. Sensor flooring material 200 has five layers laminated or adhered together. A first layer is a substrate base layer 110 which is a cellulose/polyester support reinforced with a 32 tex glass crennette. On top of the substrate layer 110 there is an undercoat layer 120 which is formed from a plastics material. On top of the undercoat layer 120, there is a sensor layer 130 comprising one or more printed layers of a piezoelectric material. On top of the sensor layer 130, there is an overcoat layer 140 which is formed from a plastics material. On top of overcoat layer 140, there is a protective coating layer 150 formed from a plastics material.

[0069] As an alternative to the embodiment depicted in FIG. 2, the sensor flooring material 200 may omit a substrate layer 110 or an undercoat layer 120. In a further alternative embodiment, the protective coating layer 150 may be a matting layer, a natural or synthetic carpet layer, a ceramic layer, a wood layer, a cork layer, a rubber layer or a stone layer. In a further alternate embodiment, sensor layer 130 may be replaced by the second, third, fourth, fifth, sixth, seventh or eighth embodiment of the sensor layer 230,330,430,530,630,730,830. In an alternative embodiment, the undercoat layer 120 may be a foamed layer which is capable of imparting a sound attenuation effect, for example an acoustic impact sound reduction of 12, 13, 14 or 15 dB.

[0070] The third embodiment of a sensor surface-covering material in the form of a sensor flooring material indicated generally at 300 is illustrated in FIG. 3. Sensor flooring material 300 has six layers laminated or adhered together. A first layer is a substrate base layer 110 which is a cellulose/polyester support reinforced with a 32 tex glass crennette. On top of the substrate layer 110 there is an undercoat layer 120 which is formed from a plastics material. On top of the undercoat layer 120, there is a sensor layer 130 comprising one or more printed layers of a piezoelectric material. On top of the sensor layer 130, there is a decorative layer 160 which comprises a layer of ink applied by printing or a printed film. On top of decorative layer 160, there is an overcoat layer 140 which is formed from a plastics material. On top of decorative layer 160, there is a protective coating layer 150 formed from a plastics material.

[0071] As an alternative to the embodiment depicted in FIG. 3, the sensor flooring material 300 may omit a substrate layer 110. In a further alternative embodiment, the protective coating layer 150 may be a matting layer, a natural or synthetic carpet layer, a ceramic layer, a wood layer, a cork layer, a rubber layer or a stone layer. In a further alternate embodiment, sensor layer 130 may be replaced by the second, third, fourth, fifth, sixth, seventh or eighth embodiment of the sensor layer 230,330,430,530,630,730,830. In an alternative embodiment, the undercoat layer 120 may be a foamed layer which is capable of imparting a sound attenuation effect, for example an acoustic impact sound reduction of 12, 13, 14 or 15 dB.

[0072] The fourth embodiment of a sensor surface-covering material in the form of a sensor flooring material indicated generally at 400 is illustrated in FIG. 4. Sensor flooring material 400 has six layers laminated or adhered together. A first layer is a substrate base layer 110 which is a cellulose/polyester support reinforced with a 32 tex glass crennette. On top of the substrate layer 110 there is an undercoat layer 120 which is formed from a plastics material. On top of the undercoat layer 120, there is a sensor layer 130 comprising one or more printed layers of a piezoelectric material. On top of the sensor layer 130, there is a decorative layer 160 which comprises a layer of ink applied by printing or a printed film. On top of decorative layer 160, there is an overcoat layer 140 which is formed from a plastics material. On top of overcoat layer 140, there is a non-slip protective coating layer 155 formed from a plastics material and comprising one or more abrasive particles 170 which are proud of the non-slip protective coating layer to provide a non-slip effect.

[0073] As an alternative to the embodiment depicted in FIG. 4, the sensor flooring material 400 may omit a substrate layer 110. In a further alternative embodiment, the protective coating layer 155 may be a matting layer, a natural or synthetic carpet layer, a ceramic layer, a wood layer, a cork layer, a rubber layer or a stone layer. In a further alternate embodiment, sensor layer 130 may be replaced by the second, third, fourth, fifth, sixth, seventh or eighth embodiment of the sensor layer 230,330,430,530,630,730,830. In an alternative embodiment, the undercoat layer 120 may be a foamed layer which is capable of imparting a sound attenuation effect, for example an acoustic impact sound reduction of 12, 13, 14 or 15 dB.

[0074] A fifth embodiment of a sensor surface-covering material in the form of a sensor flooring material indicated generally at 500 is illustrated in FIGS. 5 and 6. Sensor flooring material 500 comprises a conventional flooring material indicated generally at 500A placed on top of a sensor surface-covering material in the form of a sensor underlay indicated generally at 500B. Sensor underlay 500E has two layers laminated or adhered together and is an underlay for placing underneath a conventional flooring material. A first layer is a deformable layer 190 having a resilient lattice-shaped support structure 195 shown in FIG. 6. The resilient lattice-shaped support 195 provides the flooring material 500 with a degree of structure. Lattice-shaped support 195 forms spaces 196. As the deformable layer 190 is suitable for use in sound attenuation, it needs the support 195 to reduce rolling resistance. It has been found that such a deformable acoustic layer 190 is so deformable that it has a rolling resistance which makes it difficult to roll trolleys or other wheeled objects on it. On top of the deformable layer 190, there is a sensor layer 130 comprising one or more sheets of a piezoelectric material. The sensor layer 130 may be laminated, printed or adhered to the deformable layer. In an alternative embodiment, flooring material 500A has a protective layer on top of the sensor layer 130. The deformable layer may be formed from rubber crumb, rubber and polyolefin and/or a plastics material with a blowing agent such as blown PVC. The honeycomb support may be formed from a resilient plastics or metal such as polycarbonate or aluminium.

[0075] In an alternate embodiment, sensor layer 130 may be replaced by a sensor layer according to the second, third, fourth, fifth, sixth, seventh or eighth embodiments 230,330,430,530,630,730,830. In an alternate embodiment, the sensor underlay 500B may comprise one or more signalling regions where sensor layer 130 is replaced by a signalling layer 180. In an alternate embodiment, the sensor underlay 500B may comprise one or more non-sensing regions where sensor layer 130 is replaced by a spacer layer 185.

[0076] Where sensor layer 130 is replaced by a resistive sensor layer 530,630,730 according to the fifth, sixth or seventh embodiment of the invention, the resistive sensor layer 530,630,730 may form a bottom layer of the sensor underlay 500B such that the resistive sensor layer 530,630,730 contacts the surface to which sensor flooring material 500 is applied such that the resistive sensor layer 530,630,730 can be used to detect the presence of moisture on that surface.

[0077] A floor covering suitable for use with the sensor underlay 500E according to the invention indicated generally at 500A is illustrated in FIG. 5. Floor covering 500A has a decorative upper layer 140, an intermediate scrim layer 110 and a lower layer 120 having a lower surface which is provided with studs or profiles 125 which act as deflection aids. In use, the floor covering 500A is placed on the sensor underlay 500B such that the studs or profiles 125 ensure maximum deflection of the sensor layer 130 when a person walks on floor covering 500A. The floor covering 500A is arranged on sensor underlay 500B such that studs or profiles 125 are aligned with spaces 196 in lattice-shaped support 195. Floor covering 500A may be a floor covering as disclosed in WO 03/106783, the contents of which document is incorporated herein by reference. In an alternative embodiment, floor covering 500A may have a lower layer 120 which has a smooth lower surface such that lower layer 120 lacks the studs or profiles 125.

[0078] In an alternative embodiment, the sensor flooring material 100,200,300,400,500 may include a mechanical detectable property layer 130,230,330,430 according to the first, second, third or fourth embodiments, a resistive and/or capacitive sensor layer 530,630,730 according to the fifth, sixth or seventh embodiments of the invention and/or a capacitive sensor layer 830 according to the eighth embodiment of the invention such that it may be used as a sensor walling material for application to a wall surface. By including a mechanical detectable property layer 130,230,330,430, the sensor walling material may be used for example for pressure-sensitized audio playback. By including a resistive and/or capacitive sensor layer 530,630,730, the sensor walling material may be used to detect the presence of water at the location where the sensor walling material is used. By including a capacitive sensor layer 830, the sensor walling material may be used to form a switch which may be operated by making a gesture near the sensor walling material.

[0079] A sixth embodiment of a sensor surface-covering material indicated generally at 700 is illustrated in FIG. 16. Sensor surface-covering material 700 has two layers laminated or adhered together which include a base layer which comprises an electrical property sensor layer 530 which forms a lower face of the sensor surface-covering material 700 and an upper layer which comprises an overcoat layer 140. Sensor surface-covering material 700 may be a sensor flooring material, a sensor underlay or a sensor walling material. Sensor surface-covering material 700 is suitable for sensing the presence of a conductive object such as water at a location. Moisture beneath a flooring material or a walling material can cause damage to the building and failure of the flooring or walling material. The moisture may be caused by a water leak, rising or penetrating damp for example due to the lack or failure of a damp proof membrane, or due to a freshly laid concrete floor or wall. Without such a sensor layer 530 to detect the presence of the moisture, it may not be evident until the flooring or walling material fails because the problem is hidden.

[0080] In an alternative embodiment, the electrical property sensor layer 530 may be replaced by a detectable electrical-property sensor layer 630 or a combined detectable electrical-property and mechanical-property sensor layer 730.

[0081] A first embodiment of a sensor layer for use in the sensor flooring material according to the invention indicated generally at 130 is illustrated in FIG. 7A Sensor layer 130 is a detectable mechanical-property sensor layer. The sensor layer 130 comprises a plurality of detectable mechanical-property sensors 175A, 175B, 175C arranged horizontally into one or more sensor arrays as shown in FIG. 8A. The sensor layer 130 comprises five layers which comprise an upper printed electrical contact layer 131, an upper printed electrode layer 132A, a sensor material layer 134A, a lower printed electrode layer 135A and a lower printed electrical contact layer 136. The upper and lower electrical contact layers 131,136 are formed from a plastics material and each respectively have upper and lower conductive elements 1175A,137B,137C,138A,138B,138C embedded therein such that upper electrical contact layer 131 has a conductive element 137A,137B,137C for each sensor 175A,175B,175C and lower electrical contact layer 136 has a conductive element 138A,138B,138C for each sensor 175A,175B,175C. In each sensor 175A,175B,175C, the respective sensor material layer 134A is arranged between the upper printed electrode layer 132A and the lower printed electrode layer 135A. The electrical contact layers 131,136 and electrode layers 132A,132B,132C,135A,135B,135C are conductive layers. The conductive elements 137A,137B,137C,138A,138B,138C and electrode layers 132A,132B,132C,135A,135B,135C are formed from a printable conducting material such as a conducting polymer and/or metal, for example copper or aluminium. The sensor material layer 134A comprises an electroactive polymer, a force sensing resistor, an electret and/or a piezoelectric material.

[0082] Each sensor 175A,175B,175C comprises an upper conductive element 137A,137B,137C, an upper electrode layer 132A, a sensor material layer 134A, a lower printed electrode layer 135A and a lower conductive element 138A,138B,138C. The upper electrode 132A is connected at one or more points to an upper conductive element 137A,137B,137C in the upper electrical contact layer 131 and the lower electrode 135A is connected at one or more points to a lower conductive element 138A,138B,138C in the lower electrical contact layer 136. Each sensor 175A,175B,175C is separated horizontally by a buffer 139 of plastics material. Each sensor 175A,175B,175C may have a circular or rectilinear shape which is a similar size to a heel of a shoe.

[0083] In an alternative embodiment, the sensor layer 130 may include one or more protective layers to protect and optionally insulate the first and second electrical contact layers 131,136. In an alternate embodiment, the sensor material layer 134A may be formed from a printable sensor material. In a further alternate embodiment, one or both of the upper printed electrical contact layer 131 and lower printed electrical contact layer 136 may be provided by a layer of conducting material or one or both of the upper printed electrode layer 132 and lower printed electrode layer 135 may be provided by a layer of electrode material.

[0084] A second embodiment of a sensor layer for use in the sensor flooring material according to the invention indicated generally at 230 is illustrated in FIG. 7B. Sensor layer 230 is a detectable mechanical-property sensor layer. The sensor layer 230 comprises a plurality of detectable mechanical-property sensors 275A,275B,275C arranged into one or more sensor arrays as shown in FIG. 8A. The sensor layer 230 comprises three layers which comprise an upper printed electrical contact layer 131, a sensor material layer 234A and a second electrical contact layer 136. The sensor material layer 234A is arranged between the upper printed electrical contact layer 131 and the lower printed electrical contact layer 136. The sensor material layer 234A is formed from a sensor material which has a detectable electrical property which changes when the sensor material is deformed or moved without the need for electrodes, for example a carbon nanotube/polymer blend, and/or a piezoresistive material. In an alternate embodiment, the sensor material layer 234A may be formed from a printable material. Sensor layer 230 is a detectable mechanical-property sensor layer as it is capable of detecting a change in a mechanical property.

[0085] Each sensor 275A,275B,275C comprises an upper conductive element 137A,137B,137C, a sensor material layer 234A and a lower conductive element 138A,138B,138C where the sensor material layer 234A is connected at one or more points on its upper side to the upper conductive element 137A,137B,137C in the upper electrical contact layer 131 and at one or more points on its lower side to the lower conductive element 138A,138B,138C in the lower electrical contact layer 136. Each sensor 275A,275B,275C is separated horizontally by a buffer 139 of plastics material. Each sensor 275A,275B,275C may have a circular or rectilinear shape which is a similar size to a heel of a shoe. In an alternative embodiment, each sensor 275A,275B,275C may have a shape which is the size of one or more shoes or of part of a room, depending upon the application or use of the sensor flooring and the degree of sensitivity which is required.

[0086] A third embodiment of a sensor layer for use in the flooring material according to the invention indicated generally at 330 is illustrated in FIG. 7C. Sensor layer 330 is a detectable mechanical-property sensor layer. The sensor layer 330 comprises a detectable mechanical-property sensor 375 which comprises five layers which comprise an upper printed electrical contact layer 131, an upper printed electrode layer 132, a sensor material layer 134, a lower printed electrode layer 135 and a lower printed electrical contact layer 136. The upper printed electrical contact layer 131 comprises a plurality of upper conductive elements 137A,137B,137C. The lower printed electrical contact layer 136 comprises a plurality of lower conductive elements 138A,138B,138C. The sensor material layer 134 is arranged between the upper printed electrode layer 132 and the lower printed electrode layer 135. The upper printed electrode layer 132 is connected at one or more points on its upper side to each of the upper conductive elements 137A,137B,137C in the upper electrical contact layer 131. The lower printed electrode layer 135 is connected at one or more points on its lower side to each of the lower conductive elements 138A,138B,138C in the lower electrical contact layer 136. Sensor layer 330 is a detectable mechanical-property sensor layer as it is capable of detecting a change in a mechanical property.

[0087] In an alternative embodiment, the sensor layer 330 may include one or more protective layers to protect and optionally insulate the first and second electrical contact layers 131,136.

[0088] A fourth embodiment of a sensor layer for use in the flooring material according to the invention indicated generally at 430 is illustrated in FIG. 7D. Sensor layer 430 is a detectable mechanical-property sensor layer. The sensor layer 430 comprises a detectable mechanical-property sensor 475 which comprises three layers which comprise an upper printed electrical contact layer 1.31, a sensor material layer 234 and a second lower printed electrical contact layer 136. The upper printed electrical contact layer 131 comprises a plurality of upper conductive elements 137A,137B,137C. The lower printed electrical contact layer 136 comprises a plurality of lower conductive elements 138A,138B,138C. The sensor material layer 134 is arranged between the upper printed electrical contact layer 131 and the lower printed electrical contact layer 136. The sensor material layer 134 is connected at one or more points on its upper side to the upper conductive element 137A,137B,137C in the upper electrical contact layer 131 and at one or more points on its lower side to the lower conductive element 138A,138B,138C in the lower electrical contact layer 136.

[0089] A fifth embodiment of a sensor layer for use in the flooring material according to the invention indicated generally at 530 is illustrated in FIG. 12. Sensor layer 530 is a detectable electrical-property sensor layer. Sensor layer 530 comprises a layer of plastics material (not shown) and at least one detectable electrical-property sensor which is a conductive element sensor 533. Conductive element sensor 533 is screen printed on the layer of plastics material to form a sensor material layer. Accordingly, sensor layer 530 is suitable for sensing an electrical property such as resistivity or capacitance. The conductive element sensor 533 is applied so as to allow resistive and/or capacitive sensing where resistive sensing detects the presence of a conductive object such as water which may contact the sensor layer 530 and where capacitive sensing detects the proximity of a conductive object or of a material having a different dielectric property.

[0090] In an alternative embodiment, the conductive element sensor 533 may be applied to the sensor layer 530 by lamination, digital or gravure or flexo printing of a conductive ink (for example a conductive ink based on silver, copper, carbon, graphene, PEDOT:PSS, indium tin oxide, aluminium zinc oxide, carbon nanotubes and/or conductive nano wires).

[0091] A sixth embodiment of a sensor layer for use in the flooring material according to the invention indicated generally at 630 is illustrated in FIG. 13. Sensor layer 630 is a detectable electrical-property sensor layer. Sensor layer 630 comprises a layer of plastics material and a plurality of detectable electrical-property sensors in the form of conductive element sensors 533 in designated areas of the sensor layer 630 and which are connected by conductive connectors 637 which allow the transmission of sensor data from the conductive element sensors 533 to a signal processor (not shown), wherein the conductive element sensors 533 and connectors 637 are screen printed on the sensor layer 630. The conductive element sensors 533, connectors 637 and sensor layer 630 form a sensor material layer. Accordingly, sensor layer 630 is suitable for sensing an electrical property such as resistivity or capacitance. The plurality of conductive element sensors 533 are applied so as to allow resistive and/or capacitive sensing where resistive sensing detects the presence of a conductive object in one or more of the designated areas of the sensor layer 630 and where capacitive sensing detects the proximity of a conductive object or of a material having a different dielectric property.

[0092] In an alternative embodiment, the conductive element sensor 533 may be applied to the sensor layer 530 by lamination, digital or gravure or flexo printing of a conductive ink (for example a conductive ink based on silver, copper, carbon, graphene, PEDOT:PSS, indium tin oxide, aluminium zinc oxide, carbon nanotubes and/or conductive nano wires).

[0093] Signal processing is used to analyse the output of the electrical property sensor layer 530,630 to distinguish the sensor data which relates to the presence of a conductive object from sensor data which relates to the proximity of a conductive object or of a material having a different dielectric property.

[0094] A seventh embodiment of a sensor layer for use in the flooring material according to the invention indicated generally at 730 is illustrated in FIG. 14. Sensor layer 730 is a combined detectable electrical-property and mechanical-property sensor layer which comprises three layers which include a top layer comprising a detectable mechanical-property sensor layer in the form of a sensor layer 130 according to the first embodiment of the invention, a middle layer comprising an insulating layer 176 and a bottom layer comprising a detectable electrical-property sensor layer 530 according to the fifth embodiment of the invention. In an alternative embodiment, the applied mechanical stress sensitive sensor layer 130 may be replaced by an applied mechanical stress sensitive sensor layer 230,330,430 according to the second, third or fourth embodiments of the invention. In an alternative embodiment, the electrical property sensor layer 530 may be replaced by an electrical property sensor layer 630 according to the sixth embodiment of the invention.

[0095] By inclusion of a detectable mechanical-property sensor layer 130 in sensor layer 730, the signal processing of the output of the combined sensor layer 730 is enhanced as the mechanical detectable property data may be used to help distinguish the sensor data which relates to the presence of a conductive object from sensor data which relates to the proximity of a conductive object or of a material having a different dielectric property.

[0096] Where an electrical property sensor layer is needed to detect the presence of a conductive object at a location, electrical property sensor layer 530 should form an external surface of the sensor surface-covering material 100,200,300,400,500,600,700 in which the sensor layer 730 is used.

[0097] An eighth embodiment of a sensor layer for use in the flooring material according to the invention indicated generally at 830 is illustrated in FIG. 15. Sensor layer 830 is a combined detectable electrical-property and mechanical-property sensor layer which comprises four layers which include a top layer including a first insulating layer 176, an upper middle layer including a detectable electrical-property sensor layer 178 for detecting proximity of a conductive object or of a body having a different dielectric property, a lower middle layer including a second insulating layer 176 and a bottom layer including a detectable mechanical-property sensor layer in the form of a sensor layer 130 according to the first embodiment of the invention. Detectable electrical-property sensor layer 178 comprises a plurality of capacitor sensors for detecting a change in projected capacitance and conductive connectors.

[0098] In an alternative embodiment, the detectable mechanical-property sensor layer 130 may be replaced by a detectable mechanical-property sensor layer according to the second, third or fourth embodiment 230,330,430. In a further alternative embodiment, the detectable mechanical-property sensor layer 130 may be omitted for applications where sensing of a detectable mechanical-property is not required, for example where the sensor layer 830 is used in a sensor walling material.

[0099] A first embodiment of a sensor array for use in a sensor layer 130 for a sensor flooring material according to the invention indicated generally at 177 is illustrated in FIG. 8A. Sensor array 177 comprises a plurality of sensors 175A,175B,175C arranged in a horizontal array formed by rows of sensors 175A,175B,175C wherein each row of sensors 175A,175B,175C is connected at one or more points by a respective array of parallel upper conductive elements 137A,137B,137C and parallel lower conductive elements (not shown). The plurality of sensors 175A,175B,175C provides the sensor array 177 with a degree of redundancy such that the sensor array 177 continues to function over the lifetime of the sensor flooring material 100,200,300,400,500 according to the invention even if it is placed in a high footfall environment; and provides the sensor flooring material with the functionality that sensing may be carried out on individual parts of the sensor flooring material separately such that information about where people enter a room or corridor, where a fall or impact happened, and/or where people spend most of the time in a room or corridor could be sensed which information could be used for statistical analysis or to activate equipment such as an alarm, lighting, heating or other appliances.

[0100] In an alternative embodiment, the sensor array 177 or the sensor layer 130,230 may comprise additional upper and lower conductive elements 137A,137B,137C,138A,138B,138C in the upper and lower electrical contact layers 131,136 respectively to provide redundant electrical connectivity for the sensors 175A,175B,175C, for example upper and/or lower conductive elements which are at an angle to upper and lower conductive elements 137A,137B,137C,138A,138B,138C such as perpendicular to them. In an alternative embodiment, the plurality of sensors 175A,175B,175C according to the first embodiment of the invention may be replaced by a plurality of sensors 275A,275B,275C according to the second embodiment of the invention such that the sensor array 177 is suitable for use in a sensor layer 230. In an alternative embodiment, the plurality of sensors 175A,175B,175C may be replaced by a plurality of conductive element sensors 533 and/or a plurality of capacitor sensors.

[0101] A second embodiment of a sensor array for use in a sensor layer 330 for a sensor flooring material according to the invention indicated generally at 277 is illustrated in FIG. 8B. Sensor array 277 comprises a sensor 375 according to the third embodiment of the invention having an array of upper conductive elements 137A,137B,137C,137D,137E,137F and corresponding multiple lower conductive elements (not shown). The array of multiple conductive elements comprises a first set of parallel conductive elements 137A,137B,137C which are arranged in a first direction and a second set of parallel conductive elements 137D,137E,137F which are arranged at a perpendicular angle to the first set of parallel conductive elements 137A,137B,137C. The array of multiple conductive elements 137A,137B,137C,137D,137E,137F provides the sensor array 277 with a degree of redundancy such that the sensor array 277 continues to function over the lifetime of the sensor flooring material 100,200,300,400,500 according to the invention.

[0102] In an alternative embodiment, the sensor array 277 or the sensor layer 330 may comprise additional upper and lower conductive elements 137A,137B,137C,137D,137E,137F in the upper and lower electrical contact layers 131,136 respectively to provide additional redundant electrical connectivity for the sensor 375. In an alternative embodiment, sensor 375 may be replaced by a sensor 475 such that the sensor array 277 is suitable for use in a sensor layer 430.

[0103] A signalling layer for use in a signalling flooring material 604A,604B according to the invention indicated generally at 180 is illustrated in FIG. 9. A signalling flooring material 604A,604B is a sensor flooring material 100,200,300,400,500 where the sensor layer 130 has been replaced by a signalling layer 180. The signalling layer 180 comprises three layers which comprise an upper printed electrical contact layer 131, a synthetic layer 182 and a lower electrical contact layer 136. The upper electrical contact layer 131 comprises a plurality of upper conductive elements 137A,137B,137C and the lower electrical contact layer 136 comprises a plurality of lower conductive elements 138A,138B,138C. The spacer layer 182 is arranged between the upper printed electrical contact layer 131 and the lower printed electrical contact layer 136. The synthetic layer 182 is formed from a synthetic material. The signalling layer 180 has approximately the same thickness as sensor layer 130,230,330,430,530,630,730,830.

[0104] In an alternative embodiment, the signalling layer 180 may include one or more protective layers to protect and optionally insulate the first and second electrical contact layers 132,136. In an alternate embodiment, the spacer layer 182 may be formed from a printable material. In a further alternative embodiment, the upper and lower electrical contact layers 131,136 may include additional conductive elements. In a further alternative embodiment, the signalling layer 180 may include one electrical contact layer 131 and a synthetic layer 182.

[0105] A spacer layer for use in the spacer flooring material of the sensor flooring system according to the invention indicated generally at 185 is illustrated in FIG. 10. The spacer flooring material 606 is a sensor flooring material 100,200,300,400,500 where the sensor layer 130 has been replaced by a spacer layer 185. The spacer layer 185 comprises one layer which comprises a synthetic layer 182. The spacer layer 185 has approximately the same thickness as sensor layer 130,230,330,430,530,630,730,830 or signalling layer 180.

[0106] A sensor surface-covering system in the form of a sensor flooring system indicated generally at 600 is illustrated in FIG. 11. The sensor flooring system 600 comprises three different types of synthetic flooring material which are two regions of sensor flooring material 602A,602B, two regions of signalling flooring material 604A,604B and a non-sensing flooring material 606 and an electrical housing indicated generally at 186 comprising electrical components for the operation of the sensor.

[0107] The synthetic sensor flooring material 602A,602B may be a synthetic flooring material 100 according to the first embodiment of the invention where the sensor layer 130 is as illustrated in FIG. 7A and comprises a sensor array 177 as illustrated in FIG. 8A. The first region of synthetic sensor flooring material 602A is placed in an area where sensing is required and the second region of sensor flooring material 602B is placed in an area where additional sensing is required or where a reference level of sensing may be measured. For example, the first region of sensor flooring material 602A may be used to provide an activation region such that when activity is sensed in that first region of sensor flooring material 602A, a signal is sent or equipment is activated; and the second region of sensor flooring material 602B may be used to provide a deactivation region such that when activity is sensed in that second region of sensor flooring material 602B, a further signal is sent or equipment is deactivated. Alternatively, the first region of sensor flooring material 602A may be placed in an area of high sensing activity such as an area of high footfall or high vibrational activity and the second region of sensor flooring material 602B may be placed in an area of low 1 0 sensing activity to provide a reference level.

[0108] The synthetic signalling flooring material 604A,604B may be a synthetic flooring material 100 according to a first embodiment of the invention where the sensor layer 130 is replaced by a signalling layer 180 as illustrated in FIG. 9. Synthetic signalling flooring material 604A,604B is placed to connect synthetic sensor flooring material 602A,602B to electrical housing 186 via electrical connectors 188 as the signalling layer 180 provides an electrical connection.

[0109] The synthetic non-sensing flooring material 606 may be a synthetic flooring material 100 according to a first embodiment of the invention where the sensor layer 130 is replaced by a spacer layer 185 as illustrated in FIG. 10. Synthetic non-sensing flooring material 606 is provided in the other areas such that flooring system 600 is in the form of a continuous sheet. As the spacer layer 185 has a lower cost of manufacture than the sensor layer 130 and the signalling layer 180, the provision of the three different kinds of flooring material 602A,602B,604A,604B,606 reduces the overall cost of the flooring material 600.

[0110] The electrical housing 186 is for processing a signal generated by the sensor material and comprises a signal processor 189 and a detection system 187. Where the sensor layer 130 is replaced by a detectable electrical-property sensor layer 530,630, the signal processor 189 detects contact between the layer 530,630 with a conductive object such as water by detecting a change in the resistivity of the electrical property sensor layer 530,630.

[0111] In an alternative embodiment where the sensor layer 130 is replaced by an electrical property sensor layer 530,630 which includes one or more capacitors, the signal processor 189 is programmed to analyse the signalling data to differentiate between contact with a conductive object from proximity of a conductive object or of an object having a different dielectric property so that the location of the conductive object either above or below the sensor surface-covering system 600 can be determined. The signal processor 189 is also programmed to differentiate a proximity signal for a small conductive body (such as a hazard on a flooring system) and a large conductive body (such as a human or animal body).

[0112] In an alternative embodiment, where the sensor layer 130 is replaced by a combined detectable electrical-property and mechanical-property sensor layer 730, the signal processor 189 is programmed to detect contact between the layer 530,630 with a conductive object such as water by detecting a change in the resistivity of the electrical property sensor layer 530,630 and a physical property such as applied mechanical stress for example pressure, vibration and/or movement through detecting a change in the signal from the applied mechanical stress sensitive layer 130,230,330,430.

[0113] In an alternative embodiment, where the sensor layer 130 is replaced by a combined detectable electrical-property and mechanical-property sensor layer 830 or by a combined sensor layer 730 which includes one or more capacitors, the signal processor 189 may be programmed to analyse the signal so as to differentiate the presence of different types of object depending upon the nature of the signal such as the proximity of a conductive object and/or presence of applied mechanical stress. In particular, the signal processor 189 may be programmed to differentiate the proximity of a conductive object above or below the sensor surface-covering system 600. Examples of applications of this signal analysis include: [0114] if there is a signal indicating proximity of a conductive object but no applied mechanical stress signal, then this would indicate the presence of a light conductive object which is more likely to be a hazard such as water or organic material such as a grape or a banana skin on the flooring system. The detection system may be programmed to generate an alarm to alert the building owner to the hazard and whether it is determined to be above or below the sensor surface-covering system 600; [0115] if there is a signal indicating proximity of a conductive object with an applied mechanical stress signal, then this would indicate the presence of a human or animal body; [0116] if there is a detected applied mechanical stress signal but no signal indicating proximity of a conductive object, this would indicate the presence or movement of a non-conductive object such as a suitcase or a shopping trolley.

[0117] In an alternative embodiment, the housing may additionally comprise a communication device for communicating with a data storage centre and/or a data analysis centre. In an alternative embodiment, the housing may comprise a data storage device and data analysis centre. In an alternative embodiment, the detection system 187 may be connected electrically or wirelessly with a door opening mechanism, a lighting circuit and/or a heating mechanism to allow the sensor flooring system 600 to be used to open a door, operate lighting and/or heating.

[0118] In an alternate embodiment, the sensor layer 130 may be replaced by a sensor layer 230,330,430,530,630,730,830. In a further alternative embodiment, the synthetic flooring material 100 in the sensor flooring material 602A,602B, signalling flooring material 604A,604B, and/or non-sensing flooring material 606 may be a synthetic flooring material 200,300,400,500,700 according to the second, third, fourth, fifth or sixth embodiments of the invention. In an alternate embodiment, the synthetic flooring material 100 in the sensor flooring material 602A,602B, signalling flooring material 604A,604B and non-sensing flooring material 606 may be provided as a single continuous synthetic flooring material having sensor regions 602A,602B, signalling regions 604A,604B where the sensor layer 130 is replaced by a signalling layer 180 and non-sensing regions 606 where the sensor layer 130 is replaced by a spacer layer 185.

[0119] The invention is further illustrated with reference to the following examples which are not intended to limit the scope of the invention claimed.

PREPARATIVE EXAMPLE 1

[0120] Plastisols having the formulations given in Table 1 were produced as described below.

TABLE-US-00001 TABLE 1 Plastisol Formulations A. B. Weight/kg Weight/kg PVC polymer 15 20 PVC polymer 5 Di-isodecyl phthalate 6.5 6.5 Calcium magnesium carbonate 5 Blend of aliphatic hydrocarbons with a neutral 0.4 wetting and dispersing component Liquid barium zinc preparation containing 0.3 0.4 organic barium compounds A solution of 10,10 oxybisphenoxyarsine in 0.2 epoxidised soya bean oil Black pigment provided as a dispersion of 0.02 carbon black in a plasticiser

[0121] In each case, the ingredients were weighed in to a 50 litre steel vessel and mixed by a trifoil shaft mixer at 100 rpm for 4 minutes and a dissolver shaft at 1800 rpm for 2 minutes. Aluminium oxide particles (from Washington Mills) size F40 (FEPA Standard 42-GB-1984 measurement) were weighed into plastisol B (10% w/w) and mixed.

PREPARATIVE EXAMPLE 2

[0122] Two formulations E and F comprising a polyolefin and a rubber were prepared as follows:

TABLE-US-00002 TABLE 2 Polyolefin and Rubber Formulations E. F. Weight/kg Weight/kg Styrene butadiene rubber with 23 molar % 22 styrene content Natural rubber 7 Styrene resin 9 9 Filler 45 45 Ionomer 15 20 Ethylene butyl acrylate 5 Production aid 5 5

[0123] The ingredients listed in Table 2 for each formulation were compounded in a rubber compounder to form a sheet. The sheets were then granulated and calendered in a roller mill to form a second sheet which was then granulated to form granules having a size of from 0.1 to 40 mm.

PREPARATIVE EXAMPLE 3

[0124] Coating compositions C and D for use in the invention were prepared as follows.

[0125] A UV curable composition containing from 20 to 30 parts by weight of oxybis(methyl-2,1-ethanediyl) diacrylate, from 10 to less than 20 parts by weight of 2-phenoxyethyl acrylate, from 10 to less than 20 parts by weight of acrylate resin, from 2.5 to 5 parts by weight of (1-methyl-1,2-ethanediyl)bis[oxy(methyl-2,1-ethanediyl)]] diacrylate, from 1 to 5 parts by weight of benzophenone and from 1 to 5 parts by weight of 1-6,hexanedioldiacrylate was mixed together to obtain coating composition C. Non-slip particles in the form of glass particles having a size of about 75 to 106 m were added to the UV curable mixture at a rate of 15 parts by weight of the glass spheres to 100 parts by weight of the UV curable mixture to obtain coating composition D.

EXAMPLE 4

[0126] In this Example, the preparation of a flooring material as depicted in FIG. 1 is described.

[0127] Plastisol B was spread coated onto a substrate layer to a thickness of 1 mm by knife over roller. The substrate layer was a 2 m width cellulose/polyester support reinforced with a glass crennette moving at a rate of 7 metres/minute. The system was then passed into a convection oven where it was exposed to 160 C. for 2 minutes. The system was then passed through a series of cooling rollers before a sensor layer was applied to the substrate layer. The resulting system was laminated together by the application of pressure and heat to produce a flooring material according to the invention.

EXAMPLE 5

[0128] In this Example, an alternative method for the preparation of a flooring material as depicted in FIG. 1 is described.

[0129] Plastisol B was spread coated onto a substrate layer to a thickness of 1 mm by knife over roller. The substrate layer was a 2 m width cellulose/polyester support reinforced with a glass crennette moving at a rate of 7 metres/minute. The system was then passed into a convection oven where it was exposed to 160 C. for 2 minutes. The system was then passed through a series of cooling rollers before adhesive was applied to the underside of the substrate layer. A sensor layer was applied to the adhesive. The resulting system was adhered together by the application of pressure to produce a flooring material according to the invention.

EXAMPLE 6

[0130] In this Example, the preparation of a flooring material as depicted in FIG. 2 is described.

[0131] Plastisol B was spread coated onto a substrate layer to a thickness of 1 mm by knife over roller. The substrate layer was a 2 m width cellulose/polyester support reinforced with a glass crennette moving at a rate of 7 metres/minute. The system was then passed into a convection oven where it was exposed to 160 C. for 2 minutes. The system was then passed through a series of cooling rollers before a sensor layer and an overcoat layer formed from plastisol A were applied. The resulting system was laminated together by the application of pressure and heat.

[0132] Coating composition C was applied by roller to the laminated system at coverage rate of 20 grams per square metre. The coated system was cured using UV radiation to produce a flooring material according to the invention.

EXAMPLE 7

[0133] In this Example, the preparation of a flooring material as depicted in FIG. 3 is described.

[0134] Plastisol B was spread coated onto a substrate layer to a thickness of 1 mm by knife over roller. The substrate layer was a 2 m width cellulose/polyester support reinforced with a glass crennette moving at a rate of 7 metres/minute. The system was then passed into a convection oven where it was exposed to 160 C. for 2 minutes. The system was then passed through a series of cooling rollers before a sensor layer, an overcoat layer formed from plastisol A and a wood print PVC film decorative layer were applied. The resulting system was laminated together by the application of pressure and heat.

[0135] Coating composition C was applied by roller to the laminated system at coverage rate of 20 grams per square metre. The coated system was cured using UV radiation to produce a flooring material according to the invention.

EXAMPLE 8

[0136] In this Example, the preparation of a flooring material as depicted in FIG. 4 is described.

[0137] Plastisol B was spread coated onto a substrate layer to a thickness of 1 mm by knife over roller. The substrate layer was a 2 m width cellulose/polyester support reinforced with a glass crennette moving at a rate of 7 metres minute. The system was then passed into a convection oven where it was exposed to 160 C. for 2 minutes. The system was then passed through a series of cooling rollers before a sensor layer, an overcoat layer formed from plastisol A and a wood print PVC film decorative layer were applied. The resulting system was laminated together by the application of pressure and heat.

[0138] Coating composition D was applied by roller to the laminated system at coverage rate of 20 grams per square metre. The coated system was cured using UV radiation to produce a non-slip flooring material according to the invention.

EXAMPLE 9

[0139] In this Example, the preparation of a sensor underlay 500B as depicted in FIG. 6 is described.

[0140] Granulated formulation E, prepared as described in Preparatory Example 2 was spread over a honeycomb structure on a steel belt in a double belt press and then the material was pressed at a temperature above 130 C. such that it was vulcanised. A layer of glue was applied to the rubber layer obtained. A sensor layer was then applied and the resulting system was adhered together by the application of pressure.

EXAMPLE 10

[0141] In this Example, an alternative preparation of sensor underlay 500B as depicted in FIG. 6 is described. In this embodiment, the flooring material lacks the honeycomb structure.

[0142] Granulated formulation F, prepared as described in Preparatory Example 2 was spread over a steel belt in a double belt press and then the material was pressed at a temperature above 130 C. such that it was vulcanised. A sensor layer was then applied and the resulting system was laminated together by the application of pressure and heat.

EXAMPLE 11

[0143] In this Example, a preparation of flooring material 500A as depicted in FIG. 6 is described.

[0144] Plastisol A, prepared as described in Preparatory Example 1 but with the addition of gas filled microspheres in the form of Expancel (trademark) manufactured by Akzo Nobel to form a deformable plastics material was spread coated onto a honeycomb structure on a substrate layer to a thickness of 3 mm by knife over roller. The substrate layer was a 2 m width cellulose/polyester support reinforced with a glass crennette moving at a rate of 7 metres/minute. The system was then passed into a convection oven where it was exposed to 160 C. for 2 minutes. The system was then passed through a series of cooling rollers. A layer of glue was applied to the rubber layer obtained. A sensor layer was then applied and the resulting system was adhered together by the application of pressure. As an alternative to the gas filled microspheres, a chemical blowing agent such as an azodicarbonamide could be used.

EXAMPLE 12

[0145] In this Example, an alternative preparation of flooring material 500A as depicted in FIG. 5 is described.

[0146] Plastisol A, prepared as described in Preparatory Example 1 but with the addition of gas filled microspheres in the form of Expancel (trademark) manufactured by Akzo Nobel to form a deformable plastics material was spread coated on a substrate layer to a thickness of 3 mm by knife over roller. The substrate layer was a 2 m width cellulose/polyester support reinforced with a glass crennette moving at a rate of 7 metres/minute. The system was then passed into a convection oven where it was exposed to 160 C. for 2 minutes. The system was then passed through a series of cooling rollers. A sensor layer was then applied and the resulting system was laminated together by the application of heat and pressure. As an alternative to the gas filled microspheres, a chemical blowing agent such as an azodicarbonamide could be used.