Solid sorption refrigeration

Abstract

Integrated adsorption and heat exchanger devices are provided for solid sorption refrigeration systems (1), together with methods for making such devices. An integrated adsorption and heat exchanger device (20, 30, 45, 52) comprises a solid material having formed therein both a porous adsorption structure (21, 31, 44, 53), which is pervious to an adsorbate of said system (1), and a heat exchanger structure (22, 32), which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system (1).

Claims

1. An integrated adsorption and heat exchanger device for a solid sorption refrigeration system, the device comprising a single solid material having formed therein both a microporous adsorption structure having average pore sizes of <2 nm, which is pervious to an adsorbate of said system, and a heat exchanger structure, which is impervious to said adsorbate, for heat exchange with the microporous adsorption structure in operation of said system, the adsorption structure formed in a first portion of said same monolithic solid material and the heat exchanger structure formed in a remaining portion of the same monolithic solid material.

2. A device as claimed in claim 1 wherein the heat exchanger structure is adapted for contacting a heat transfer fluid of the system to exchange heat between said fluid and the adsorption structure.

3. A device as claimed in claim 1 wherein the microporous adsorption structure is inherently adsorbent due to the porosity thereof.

4. A device as claimed in claim 1 wherein the microporous adsorption structure has an adsorbent material deposited on the pore surfaces thereof.

5. A device as claimed in claim 1 wherein the microporous adsorption structure has projecting surface formations to increase the surface area exposed to adsorbate in said system.

6. A device as claimed in claim 1 wherein the heat exchanger structure has projecting surface formations to increase the surface area for heat transfer.

7. A device as claimed in claim 5 wherein said projecting surface formations are hierarchically patterned.

8. A device as claimed in claim 1, the device comprising a layer of said solid material having the microporous adsorption structure and the heat exchanger structure formed in opposite surfaces thereof.

9. An adsorber apparatus comprising: a plurality of integrated adsorption and heat exchanger devices, each integrated adsorption and heat exchanger device of said plurality comprising: a single solid material having formed therein both a microporous adsorption structure having average pore sizes of <2 nm and a heat exchanger structure, the microporous adsorption structure formed in a first portion of said same monolithic solid material and the heat exchanger structure formed in a remaining portion of the same monolithic solid material, the microporous adsorption structure being pervious to an adsorbate of a solid sorption refrigeration system, and the heat exchanger structure being impervious to said adsorbate for heat exchange with the microporous adsorption structure in operation of said system.

10. The apparatus as claimed in claim 9 comprising at least one pair of devices, said devices each comprising a layer of said single solid material having the microporous adsorber structure and the heat exchanger structure formed in opposite surfaces thereof, and, the devices of the pair being arranged with either their microporous adsorption structures or their heat exchanger structures facing each other.

11. A device as claimed in claim 6 wherein said projecting surface formations are hierarchically patterned.

Description

(1) Preferred embodiments of the invention will now be described, by way of example, with reference to the accompanying drawings in which:

(2) FIGS. 1a and 1b illustrate different operating phases of a solid sorption refrigeration system;

(3) FIG. 2 illustrates a first integrated adsorption and heat exchanger device embodying the invention;

(4) FIG. 3 illustrates a second integrated adsorption and heat exchanger device embodying the invention;

(5) FIGS. 4a to 4d illustrate successive stages in a first method for making an integrated adsorption and heat exchanger device;

(6) FIGS. 5a to 5d illustrate successive stages in a second method for making an integrated adsorption and heat exchanger device; and

(7) FIG. 6 compares heating and cooling profiles for a conventional adsorbent material and an integrated device embodying the invention.

(8) FIGS. 1a and 1b are schematic illustrations of an exemplary solid sorption refrigeration system 1 in which integrated adsorption and heat exchanger devices embodying the invention may be employed. The two figures illustrate the two main phases of the refrigeration cycle, with the solid arrows representing heat flow in each case. This simple system includes adsorber apparatus, consisting of two adsorber units 2, a condenser 3 and an evaporator 4. A pipe for passage of condensate from condenser 3 to evaporator 4 terminates in a control device 5, here an expansion valve. The adsorber units 2 are connected to evaporator 4 and condenser 3 via one-way valves 6, 7 as indicated in the figure.

(9) Each adsorber unit 2 of the system comprises a plurality of integrated adsorption/heat exchanger devices to be described in detail below. These devices are arranged in each unit such that refrigerant vapor, received from the evaporator 4 via valve 6 during the adsorption phase, flows over the adsorbent structures of the devices and is channeled via these structures toward condenser 3 during desorption, escaping from the unit via valve 7 during this phase. During these processes, a heat transfer fluid (HTF), usually water-based, flows over the heat exchanger structures of the integrated devices and is channeled by these structures between fluid inlets and outlets (not shown in the figures) of unit 2. Three reservoirs (not shown) at different temperatures are employed for operation of the system 1: a high temperature (hot) reservoir, a low temperature (chilled) reservoir, and an intermediate temperature (cold) reservoir as discussed further below. In practice, each reservoir may be connected to the system in FIGS. 1a and 1b by separate HTF loops. The particular mechanisms via which the refrigerant and HTF are delivered to and from the integrated adsorption/heat exchanger devices in each adsorption unit 2 will depend on the precise form and arrangement of these devices. Such mechanisms are, however, generally known in the field of adsorption systems, and suitable mechanisms for a given case will be apparent to those skilled in the art.

(10) The basic operating cycle is illustrated in the figures for the right-hand adsorber unit 2. FIG. 1a illustrates the desorption phase of the cycle. At the start of this phase, the refrigerant fluid (e.g. water or methanol) is fully adsorbed within adsorber unit 2. The adsorber unit is then heated by supplying hot HTF to the unit. Heat is thus transferred via the heat exchanger structures to the adsorbent structures, causing evaporation and hence desorption of the refrigerant. The refrigerant vapor passes via valve 7 to condenser 3 where the vapor condenses under the high pressure resulting from the desorption process. Heat is rejected to the environment during this process and transferred to cold HTF. The adsorption phase commences when condensation is complete. The liquid refrigerant is passed though expansion valve 5 into evaporator 4 causing partial vaporization. As shown in FIG. 1b, the reduced pressure in evaporator 4 results in further evaporation of refrigerant, drawing heat from the environment during this process and thus causing environmental cooling and a low temperature of chilled HTF. Refrigerant vapor passes via valve 6 to adsorber unit 2 and is readsorbed, reducing system pressure and promoting further vaporization. Heat rejected by the refrigerant during adsorption is transferred via the heat exchanger structures in the unit 2 to cold HTF at intermediate temperature. The adsorption phase continues until the refrigerant is fully adsorbed and the cycle is then complete.

(11) To obtain more continuous cooling, the left-hand adsorber unit in system 1 can be driven in antiphase with the right-hand unit. Thus, the adsorption phase of one unit occurs concurrently with the desorption phase of the other unit. While only two adsorption units are provided in the simple system shown, in practice multiple units can be operated with appropriate phase shifts to produce more efficient and continuous cooling. Moreover, in simpler systems the heat transfer may be realized by direct irradiation or convection rather than via HTF. In any case, in each adsorption unit 2, the basic cycle is driven entirely by heat input from the HTF (FIG. 1a). This fact makes these systems particularly useful in scenarios where waste or excess heat is readily available. An exemplary application envisaged here, known as solar cooling, is one in which the hot HTF is generated by solar irradiation. Another exemplary application is one in which the hot HTF is provided by waste heat from servers in a datacentre. The waste heat may be collected at a suitably high temperature by appropriate datacentre cooling technology as described, for example, by Brunschwiler et al. in IBM Journal of Research and Development 53(3) (2009) 1-13. The datacentre waste heat is converted to cooling for the datacentre itself or to satisfy other peripheral cooling demand.

(12) A first embodiment of an integrated adsorption/heat exchanger device which can be used in the above systems will now be described with reference to FIG. 2. The basic structure of the device is indicated by the schematic cross-sectional view shown in the figure. The integrated device 20 of this embodiment is in the form of a generally flat layer, or sheet, of solid material which has a porous adsorption structure 21 formed in one surface and a heat exchanger structure 22 formed in its opposite surface. The adsorption structure 21 comprises a surface layer of the device 20 which has been processed as described below to make this layer porous and hence pervious to the adsorbate to be used with the device. In this example, the adsorption structure has a thickness of approximately 60 m and a pore size of less than about 10 nm. (The actual adsorption layer thickness, structure and pore size will depend on the particular materials and processes employed as discussed further below, but pore sizes of less than about 10 nm are preferred for effective adsorption with smaller pore sizes, e.g. less than about 2 nm, being ideal.) The remaining, non-porous portion of the device forms the heat exchanger structure 22. This structure has a series of fins 23 projecting from the surface 24 thereof. These fins increase the surface area which contacts the HTF in operation, improving heat transfer efficiency, and define convenient channels for conveying HTF in use. Although not illustrated in the figure, the surface fins 23 are hierarchically patterned in this embodiment. That is, the fins are formed in a hierarchically repetitive pattern of larger fins having smaller surface fins which in turn have smaller surface fins, and so on as far as processing techniques (discussed below) allow. Alternative HTF channel structures such as jet-impingement manifolds or flow-by architectures may be readily envisaged by those skilled in the art. Fin height is approximately 100 m in this example and the distance between the inner heat exchanger surface 24 and the porous adsorption structure 21 is approximately 10 m.

(13) The nanoscale porosity of the adsorption structure 21 renders this structure inherently adsorbent. In particular, efficient adsorption can occur in this structure without addition of further adsorbent material. The porosity provides an extensive internal surface area for adsorption with a continuous porous network providing ease of access and fast pervasion of adsorbate throughout the structure. The continuous solid phase in adsorption structure 21 enhances thermal conductivity, and all thermal barriers which hamper heat transport in prior devices are eliminated in the integrated device 20. The sheet-like formation of the integrated device 20 also allows minimal separation of the heat exchanger surface 24 (and hence HTF in use) from the adsorption structure 21. This distance is limited only by the need for structural integrity, and distances less than 10 m may be possible depending on material selection. In any case, a minimal distance here further increases thermal efficiency and also reduces active to dead mass ratio in the device. Overall, therefore, device 20 provides exceptional heat transfer efficiency between HTF and adsorbate in operation of the adsorption system.

(14) FIG. 3 shows a second, preferred integrated device embodying the invention. The device 30 of this embodiment is generally similar to device 20 above, having a porous adsorption structure 31 and a heat exchanger structure 32 integrally formed in the same solid material. However, the adsorption structure 31 is also formed with projecting surface formations, again in the form of hierarchically patterned fins 34, to increase the surface area exposed to adsorbate for enhanced adsorption efficiency. The resulting channels also direct flow of adsorbate vapor in use. Fins 34 are substantially the same height as the heat exchanger fins in this example, for instance about 100 m. In general, however, fin height (and the extent of any hierarchical patterning) may differ on both sides and can be varied as required depending on desired characteristics and the particular fluids employed in a system. In some cases, adequate heat transport efficiency may be obtained by forming fins (or other projecting formations) on the adsorption side only of a device. Devices having substantially smooth surfaces (i.e. without projecting formations) on both sides can also be envisaged.

(15) Integrated devices embodying the invention can be formed of a variety of materials using various different processing techniques. By selection of a suitable material for the devices described above, micro-machining technology can be applied to manufacture microchannel manifolds for the heat transfer fluid on one side as well as a porous adsorbent structure on the other side. Hence, the material used preferably lends itself well to micromachining and the synthesis of a suitable porous structure. Thermal conductivity is also implicitly relevant to device functionality, and this property (together with other device parameters) can be selected as required to achieve a desired level of performance. In general, however, the higher the thermal conductivity , the better the heat transport, and materials having a bulk of at least about 100 W/(m.Math.K) are ideally employed.

(16) Particularly preferred device fabrication methods employ a top down fabrication approach, involving subtractive manufacturing of the various device features. An example of such a method for making the integrated device FIG. 2 will now be described. FIGS. 4a to 4d are schematic illustrations of successive stages in the subtractive manufacturing process. The process uses a monolithic starting material 41, selected among suitable materials described below, as shown in FIG. 4a. In a first step illustrated in FIG. 4b, the HTF channels 42 are fabricated. The adsorbent structure 44 is then introduced by a top-down process, represented by arrows 43 in FIG. 4c, which may involve chemical, electrochemical or physical techniques as discussed below. The duration and intensity of this process is adjusted to obtain the desired thickness of adsorption structure in the final integrated device 45 of FIG. 4d. Variations in the sequence of the processing steps and the directionality of porosity generation depicted in these figures may be desirable depending on choice of starting material.

(17) FIGS. 5a to 5d are schematic illustrations of successive stages in another fabrication process which uses templated synthesis based on carbon. In this process, the porous network is defined by a sacrificial template of inorganic material. Examples of template materials which might be used here include zeolites and silica. The template material is granular in form and highly porous itself, with the pore size of the final device being defined by the solid fraction of the template material. In a first step as indicated in FIG. 5a, the inorganic template material 50 is placed in a suitable mold (not shown). Next, as indicated in FIG. 5b, the template material 50 is infiltrated by a suitable carbon source, e.g. a carbonaceous resin, which is subsequently pyrolyzed to deliver a continuous solid phase 52 with a high carbon content. Next, the template material is removed from the carbon phase 52 by a process such as acid leaching to produce the porous adsorption structure 53 shown in FIG. 5c. The HTF channels and fins 54 are then fabricated in the heat-exchanger surface. The resulting integrated device 55 is shown in FIG. 5d.

(18) Techniques to manufacture HTF microchannels, as defined by the (preferably hierarchically patterned) surface fins in the above embodiments, are generally well known in the art and need not be described in detail here. An important aspect of the microchannel design and fabrication is the simultaneous fulfillment of short heat transfer paths from the HTF to the heat exchanger material and an efficient fluid distribution network. A number of hierarchical structures have been devised and demonstrated to achieve this, and these known techniques can be readily employed in embodiments of the invention as will be apparent to those skilled in the art. In preferred embodiments these techniques are also applied to produce hierarchical surface formations on the adsorption structure as in the device 30 of FIG. 3. The particular fabrication process preferred will of course depend on the basic material of the integrated device. Examples of technologies for producing efficient microchannel heat exchanger/adsorption structures include: lithographic techniques based, for example, on anisotropic wet chemical etching or deep reactive ion etching (for instance for silicon or silicon carbide devices); oxygen-ion-beam etching for carbon structures; LIGA (lithography, electroplating and molding) for a variety of materials including metals, ceramics, polymers and glasses; mechanical techniques, e.g. cutting (skiving), milling, electro-discharge, and ultrasonic/waterjet cutting for instance for metal structures; and laser machining, e.g. for carbon.

(19) Adsorption apparatus embodying the invention typically employs a plurality of integrated devices such as those described above. For example, the active surfaces can be doubled by arranging two such devices with like structures (i.e. the two adsorption structures or the two heat exchanger structures) facing one another. As one example of such a bi-layer module, two devices 20 or 30 could be arranged with their heat exchanger fins interlocking and spaced from one another to define the HTF channels. One of the two devices in such an arrangement may also have a flat heat exchanger surface. Similarly, adsorption modules can be constructed with adsorption structures facing one another. Particularly preferred adsorption units incorporate a stack of such modules to increase the active surface areas in the unit as a whole.

(20) As will be apparent to those skilled in the art, various other fabrication techniques can be used to make integrated devices embodying the invention. Some examples are described in the following.

(21) Porous carbon may be fabricated using various different methods. Expanded graphite may be produced by soaking a suitable graphite in a solution containing an intercalate, such as H.sub.2SO.sub.4, followed by heat treatment for removal of the intercalate and concomitant exfoliation of the graphite layers. Glass-like carbon may also be used as a starting material, in which case the inherent closed microporosity can be made accessible by suitable activation techniques including chemical or electrochemical processes. Following activation, the pore sizes obtained are in the nanometer range, thus being suitable per se as adsorbent material as in the devices of FIGS. 2 and 3. Porous carbon structures may also be obtained from silicon carbide or titanium carbide by chlorination. The remaining carbonaceous network is highly porous and suitable for use as an adsorbent structure.

(22) In devices based on silicon as a starting material, a porous silicon structure may be formed in p-type silicon upon anodic polarization in hydrogen fluoride solutions. Conversion of the pore surface to hydrated silica can be achieved by oxidation at moderate temperatures (e.g. 300 C.) and exposure to water. Porous silicon exhibits typical pore diameters below 10 nm and thus offers suitable chemical and structural features to act as adsorbent.

(23) Various other materials and processes for producing devices with inherently adsorbent porous structures will be apparent to those skilled in the art. In other embodiments of the invention, however, adsorbency of the porous adsorption structure may be provided or enhanced by the application of an adsorbent material to the basic porous structure. By way of example, in devices based on metals, various known techniques can be used to produce a porous metal structure with pore sizes in the range of tens of millimeters or larger. Commercially preferred fabrication techniques include: bubbling gas through the melt; stirring a foaming agent into the melt; consolidation of metal powder with a foaming agent; manufacture of ceramic mold from a suitable precursor, followed by burning-out of the precursor. Notably, directional pores may be obtained in metals by unidirectional solidification under pressurized gas. Porous metals which are suitable for heat sink applications and have been produced by the aforementioned methods include aluminium, copper and nickel. In general in these structures, however, the pore sizes are too large, and the associated surface area per given unit volume too small, for direct use as adsorbent material. Here, therefore, the deposition of an adsorbent material on the pore surfaces as an additional layer is preferred. Such an adsorbent coating can be applied using generally known techniques, e.g. by direct synthesis of adsorbent on the porous structure or by application in a suitable matrix. In general, however, it is desirable for such an additional adsorbent material to be as similar as possible to the basic device material in order to minimize thermal interfaces. The closer the speed of sound in the two materials, the less pronounced the thermal interface. Hence, material selection should consider both the material density and the Young's modulus, these properties being the primary factors determining speed of sound in the material. It will be appreciated, however, that the effect of any thermal interface introduced by such a coating will be considerably alleviated by the advantages of the underlying porous structure, this providing an extensive and fully accessible porous network with high permeability and fast access for adsorbate vapor.

(24) Nanoporous metals can be produced by known dealloying techniques. Such materials could be used either with an additional adsorbent coating or in the as-produced state in integrated metal devices embodying the invention, offering a sufficiently large surface-area-to-volume ratio to act directly as an adsorbent. Another method for producing nanoscale porous structures in metals, e.g. aluminium, is anodic oxidation.

(25) When using manufacturing techniques based on porous metals, it may be preferable to manufacture the porous structure prior to micromachining of the HTF channels. It is a feature of the fabrication methods described above that the depth of the porous layer can be controlled during processing so that sufficient bulk material remains for manufacture of the HTF channels. In general, however, the order of processing steps is not critical and could be varied if desired. For example, devices embodying the invention can be produced by first patterning high aspect ratio fins on both sides of a support structure. One side of the structure is then further processed, e.g. by anodic oxidation to produce the adsorption structure while the other side is left with the high aspect ratio fins for the HTF channels. To boost the active to dead mass ratio, adsorbent particles may also be deposited in between the fins on the adsorption structure side. As already discussed, however, such particles should be made from a material as similar as possible to the basic device material in order to minimize thermal interfaces.

(26) In the above processes, the top-down (subtractive) fabrication of the porous structure by chemical, electrochemical or physical means involving foreign species inherently results in an open porous network with fully accessible pores and an intrinsically low tortuosity and high permeability toward the adsorbate vapor. Such a porous structure is clearly superior in terms of sorption kinetics compared to conventional devices such as isotropic granular beds. However, while the described methods involve forming a porous structure in a non-porous starting material, embodiments can be envisaged in which the basic solid material is porous and heat exchanger structure is formed by processing a portion of the solid material to render that portion non-porous. As one example here, porous silica as a starting material could be exposed to pore-blocking agents such as hydrocarbons applied in solution or by vapor deposition processes to create a non-porous heat exchanger structure. Alternative materials and processes here will be apparent to those skilled in the art.

(27) It will be seen from the foregoing that, by integrating the heat exchanger and adsorption structures in the same material, embodiments of the invention provide highly efficient adsorption and heat exchanger mechanisms for solid sorption refrigeration systems. In particular, the heat transfer coefficient of the integrated heat exchanger/adsorption structure in preferred embodiments is superior to a conventional granular adsorbent bed packed on a metallic heat exchanger by at least two orders of magnitude. Further, the thermal conductivity of the device is superior to the conventional art by at least one order of magnitude by virtue of the continuous solid phase in the adsorbent structure. The time taken to heat the integrated device to a desired temperature is therefore significantly shorter than for the granular adsorbent bed, leading to faster operating cycles and more compact systems with higher coefficients of performance. By way of illustration, the graph of FIG. 6 compares performance of a conventional silica gel-based solid sorption system to an integrated silica heat exchanger/adsorption device embodying the invention. The graph shows the average adsorbent temperature during heating and cooling cycles between a high temperature level (generator temperature) and an intermediate temperature level (adsorber temperature) for constant heat source and sink temperatures of 65 C. and 30 C. respectively. Physical characteristics of porous silica were used to compute the temporal evolution of the temperature profiles. The adsorbent material thickness was 1 cm. The heat transfer coefficients were 20 W/(m.sup.2.Math.K) (granular adsorbent) and 2000 W/(m.sup.2.Math.K) (integrated device) while the thermal conductivities were 0.1 W/(m.Math.K) and 10 W/(m.Math.K) respectively. As illustrated by the graphical profiles FIG. 6, the time needed to cycle the adsorbent material between the temperature extremes was reduced from 2550 s with the conventional technology to 128 s with the integrated device. Accordingly, the specific cooling power (SCP) was increased by a factor of about 20.

(28) It will of course be appreciated that many changes and modifications can be made to the exemplary embodiments described above. By way of example, surface features other than fins, including various other hierarchically patterned features, can be envisaged. Integrated devices embodying the invention can also be formed with a variety of overall shapes other than the flat, sheet-like structures described above. Such sheets could, for example be formed into pipes having variety of cross-sectional shapes as discussed earlier. Also, in some embodiments heat transfer between the environment and heat exchanger structure could occur by direct irradiation or convection rather than via HTF, and the heat exchanger structure could be adapted accordingly. Heat may, for instance, be supplied by solar irradiation. In this case, the heat exchanger structure of the integrated device could serve as the external housing of the adsorption apparatus.

(29) Adsorber units may contain multiple integrated devices in various arrangements, and more than two adsorber units operating with appropriate phase shifts can be employed to achieve a desired degree of continuous cooling. Multiple units may also be arranged to employ known heat-wave and mass recovery concepts. Heat wave operation is particularly beneficial for low thermal resistance adsorption units since the outflux of the first container can be used to preheat the next container, and so forth. This minimizes the use of energy relative to the amount of desorbed medium.

(30) Many other changes and modifications can be made to the embodiments described without departing from the scope of the invention.