Method for manufacturing an electronic component carrier for mounting the electronic component to a circuit board

Abstract

A method is disclosed for manufacturing an electronic component carrier. The method comprises positioning a header of a frame between opposing attachment arms extending outwardly for attaching an electronic component for seating within the frame. Further, latching members of a latching mechanism of the frame are positioned at a distal end of each of the attachment arms for releaseably seating the electronic component. The attachment arms are resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position for releasing and grasping the electronic component. Handling levers are positioned for removably mating the electronic component to a connector on a circuit board. The handling levers extend upwardly through an outer casing housing the circuit board when in an open position, and the handling levers are substantially parallel with a top surface of the header when in a closed position.

Claims

1. A method, comprising: positioning a header of a frame between opposing attachment arms for seating an electronic component in the frame; positioning latching members of a latching mechanism of the frame at a distal end of each of the attachment arms for releaseably seating the electronic component between the attachment arms, the attachment arms being resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position for releasing and grasping the electronic component, respectively; positioning handling levers for removably mating the electronic component to a connector on a circuit board, the handling levers extending upwardly through an outer casing housing the circuit board when in an open position for manually removing the electronic component from the connector, and the handling levers being substantially parallel with a top surface of the header when in a closed position when the electronic component is mated to the connector; and positioning a moveable locking device within grooves of the attachment arms, wherein each of the grooves extend down a length of one of the attachment arms from a proximal end of the attachment arm.

2. A method, comprising: positioning a header of a frame between opposing attachment arms extending outwardly for attaching an electronic component for seating within the frame; positioning latching members of a latching mechanism of the frame at a distal end of each of the attachment arms for releaseably seating the electronic component between the attachment arms, the attachment arms being resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position for releasing and grasping the electronic component, respectively; positioning handling levers for removably mating the electronic component to a connector on a circuit board, the handling levers extending upwardly through an outer casing housing the circuit board when in an open position for manually removing the electronic component from the connector, and the handling levers being substantially parallel with a top surface of the header when in a closed position when the electronic component is mated to the connector; and positioning a release button within the header and centrally between the handling levers.

3. A method for mounting an electronic component to a circuit board, the method comprising: releaseably seating an electronic component between opposing resiliently deformable attachment arms of a frame including a header using a latching mechanism; opening handling levers for removably mating the electronic component to a receiving slot on a circuit board, the handling levers extending upwardly from the header through an outer casing housing the circuit board when in an open position for manually removing the electronic component from the receiving slot of the circuit board; when the electronic component is mated to the receiving slot, closing the handling levers to be positioned substantially parallel with a top surface of the header; and positioning a moveable locking device in grooves of the attachment arms, such that the moveable locking device is slideably positioned between the opposing attachment arms.

4. The method of claim 3, further comprising: bending resiliently deformable latching members to a release position and allowing the latching members to return to a grasping position for releasing and grasping the electronic component, respectively, the latching members being part of the latching mechanism and being positioned at a distal end of each of the attachment arms.

5. The method of claim 3, wherein releaseably seating the electronic component between the opposing attachment arms of the frame comprises releasably seating the electronic component between the latching members at the distal ends of the opposing attachment arms.

6. The method of claim 5, further comprising sliding the moveable locking device positioned between the opposing attachment arms such that the moveable locking device locks the electronic component between the opposing attachment arms.

7. The method of claim 6, wherein the moveable locking device engages a top of the electronic component for locking the electronic component between the opposing attachment arms.

8. The method of claim 7, wherein the electronic component is a Dual In-line Memory Module (DIMM).

9. The method of claim 7, further comprising lowering the electronic component between the opposing attachment arms of the frame, and aligning the electronic component into the receiving slot of the circuit board.

10. The method of claim 9, further comprising lowering the handling levers into a closed position.

11. The method of claim 3, further comprising attaching a heat transfer device to the moveable locking device.

12. The method of claim 11, wherein releaseably seating the electronic component between the opposing attachment arms of the frame comprises releasably seating the electronic component between the latching members at the distal ends of the opposing attachment arms.

13. The method of claim 12, further comprising sliding the moveable locking device positioned between the opposing attachment arms such that the moveable locking device locks the electronic component between the opposing attachment arms, and the heat transfer device is in thermal communication with the electronic component.

14. The method of claim 13, wherein the heat transfer device at least partially covers the electronic component.

15. The method of claim 14, wherein the electronic component is a Dual In-line Memory Module (DIMM).

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

(1) These and other objects, features and advantages of the present invention will become apparent from the following detailed description of illustrative embodiments thereof, which is to be read in connection with the accompanying drawings. The various features of the drawings are not to scale as the illustrations are for clarity in facilitating one skilled in the art in understanding the invention in conjunction with the detailed description. In the drawings:

(2) FIG. 1 is an isometric view of a prior art circuit board of a computer having a DIMM inserted into a receiving slot of a connector on the circuit board;

(3) FIG. 2 is a detailed isometric view of the DIMM being removed from the slot in the connector as shown in FIG. 1, according to the prior art;

(4) FIG. 3 is an isometric view of a computer system assembly including a housing, circuit board, and carrier assembly according to an embodiment of the invention;

(5) FIG. 4 is a detailed isometric view of the carrier assembly shown in FIG. 3;

(6) FIG. 5 is an isometric assembly view of the carrier assembly shown in FIG. 4 depicting multiple carriers holding DIMMs, a housing positioned over connectors mounted on a circuit board using screws and a frame under the circuit board;

(7) FIG. 6 is an isometric view of the DIMM carrier shown in FIGS. 3-5 holding a DIMM and including a slide member;

(8) FIG. 7 is a detail isometric view of an arm of the DIMM carrier showing the inside of the arm and attachment members;

(9) FIG. 8 is a detail isometric view of another arm of the DIMM carrier showing the outside of the arm and the vertical motion of the slide member;

(10) FIG. 9a is a front elevational view of the DIMM carrier shown in FIG. 6 having handling levers in an open position, opposing vertical arms, and a slide member between the arms;

(11) FIG. 9b is a front elevational view of the DIMM carrier shown in FIG. 9a wherein the arms are resiliently bend outwardly for insertion of a DIMM therebetween;

(12) FIG. 9c is a front elevational view of the DIMM carrier shown in FIG. 9b with the DIMM in place between the arms;

(13) FIG. 9d is a front elevational view of the DIMM carrier shown in FIG. 9c with the slide member being moved down to rest on top of the DIMM;

(14) FIG. 10a is an isometric view of the DIMM carrier shown in FIGS. 6 and 9a;

(15) FIG. 10b is an isometric view of the DIMM carrier shown in FIG. 10a including a heat transfer element attached to the slide member;

(16) FIG. 10c is an isometric view of the DIMM carrier shown in FIG. 10b having the heat transfer element slid down to overlap a portion of the DIMM;

(17) FIG. 11 is an isometric view of the top of the housing shown in FIGS. 4 and 5 for a plurality of carriers showing handling levers in open and closed positions;

(18) FIG. 12 is a side elevational view of the carrier assembly shown in FIGS. 4 and 5 shown mounted to the circuit board;

(19) FIG. 13 is a front elevational view of the carrier assembly shown in FIG. 12;

(20) FIG. 14a is a front elevational view of the DIMM carrier with handling levers open being inserted in to the housing of the DIMM carrier;

(21) FIG. 14b is a front elevational view of the DIMM carrier of FIG. 14a inserted into the housing and the handling levers being closed;

(22) FIG. 14c is a front elevational view of the DIMM carrier of FIG. 14b inserted into the housing and the handling levers in the closed position;

(23) FIG. 15a is a front relational view of the DIMM carrier of FIG. 14c inserted into the housing and the handling levers being released by pressing a release mechanism;

(24) FIG. 15b is a front elevational view of the DIMM carrier of FIG. 15a with the handling levers being opened; and

(25) FIG. 15c is a front elevational view of the DIMM carrier of FIG. 15b being removed from the housing using the handling levers.

DETAILED DESCRIPTION

(26) Referring to FIGS. 3-5, a carrier assembly 100 according to an embodiment of the disclosure for carrying an electronic component is positioned in a computer housing 104. The computer housing 104 includes mating top and bottom pieces 106, 108, respectively. The carrier assembly 100 is one embodiment of an apparatus, carrier device, or carrier system, for holding and carrying electronic components which may be used in a method for carrying an electronic component such as a Dual In-Line Memory Module (DIMM). The carrier assembly 100 shown in FIGS. 4 and 5 includes a housing 110, a plurality of carriers 120, and connectors 160. The connectors 160 are attached to a circuit board 170 using a plate 180 positioned beneath the circuit board 170. Screws 184 through the plate 180, circuit board 170, and connectors 160 attached the connectors to the circuit board. For illustrative purposes the electronic component is a DIMM 150 as shown in the FIGS. The plurality of carriers 120 as shown in FIG. 5 are holding DIMMs 150. The connectors 160 include slots 162 for seating the DIMMs. The housing 110 includes openings 112 for accommodating extensions 142.

(27) Referring to FIGS. 6-8, the carrier 120 is shown in more detail and described hereinafter. The carrier 120 includes a frame 122 which includes a header 124 and opposing attachment arms 126. Two handling levers 140 are pivotably attached to the header 124 at pivot points 132. A release button 148 is an embodiment of a release mechanism for the handling levers 140 is positioned centrally between the levers 140 which are in a closed position flush with the top of the header 124.

(28) The arms 126 are shown in detail in FIGS. 7 and 8. A distal end of the arms 126 includes an inwardly facing groove 128 and latching members 130 as an embodiment of a latching mechanism. The DIMM 150 is seated in the groove 128. The latching members 130 include hooks 132 defining a groove 134 therebetween for holding the DIMM 150 as an embodiment of locking element, as shown in FIGS. 5 and 6. The arms 126 are resiliently bendable so that the DIMM 150 can be removed and attached between the arms 126, as discussed in more detail below with respect to FIG. 9b.

(29) One embodiment of a moveable locking device 190 is positioned between the arms 126 above the DIMM 150. A end slide 192 fits through a groove 194 so that the locking device can slide in the groove 194. The locking device slides downwardly to mate with the top of the DIMM to lock the DIMM in place between the arms.

(30) Referring to FIGS. 9a-9d, the carrier 120 includes the locking device 190 between the arms 126. The handling levers 140 are in an open position. In FIG. 9b, the arms 126 are resiliently bent outwardly to insert the DIMM 150 therebetween. The hooks 132 on the latching members 130 of the arms 126 mate with notches 152 on the DIMM 150. In FIG. 9c, the resilient arms 126 are allowed to return to their initial positions having the DIMM 150 held therebetween. The locking device 190 is slid downwardly to contact the top of the DIMM 150 locking the DIMM in position. The locking device 190 prevents the arms 126 from being bent outwardly, thus preventing the DIMM 150 from being released.

(31) Referring to FIGS. 10a-10c, the carrier 120 is fitted with a heat transfer device or a heat sink 200 which attaches to the locking device 190. The heat transfer device is optional in the carrier. The heat transfer device 200 is positioned between the arms 126 above the DIMM 150, as shown in FIG. 10b. When the locking device 190 is moved downwardly to lock the DIMM in place, the heat sink 200 pressure fits over the DIMM, partially covering the DIMM as shown in FIG. 10c. The heat transfer device 200 provides heat transfer from the DIMM 150 or other electronic component to maintain a desirable temperature of the DIMM. In an alternative, the heat sink and the locking device may be one integral device providing the combined functions of locking the arms and DIMM, and transferring heat from the DIMM.

(32) Referring to FIGS. 11-13, the handling levers 140 of a carrier are shown in the open position. Extensions 142 (can be generically referred to as extension elements) extend from the distal ends of the handling levers 140 and extend through openings 144 in both side of the housing 110 which mate with openings in both sides of the header, respectively. When the handling levers 140 are in the open position, the extensions 142 toggle at a downward incline through the openings 144 such that the carrier can be lifted out of the housing. When the handling levers 140 are being closed, the extension 142 toggle upwardly meeting the top of the opening 144 connectively exerting downward pressure on DIMM in the slot via the frame 122, thereby, seating the DIMM in the slot of the connector. Thus, when the handling levers 140 are in the closed position, the extensions 142 extend horizontally through the openings 144 abutting the top of the opening 144, locking the carrier 120 in the housing 110 and seating the DIMM in the slot of the connector. The handling levers thus have a caming effect by the extensions interacting with the header and housing through the openings to lock and release the DIMM from its slot.

(33) Referring to FIGS. 14a-14c, a sequence is shown regarding a method of mounting the DIMM on the circuit board using the carrier 120. The handling levers 140 are used to lower the DIMM attached to the arms of the carrier 120 into the housing 110 in FIG. 14a. The DIMM is aligned into a slot in the connector. Once the DIMM is seated in the slot of the connector, the handling levers 140 are lowered into their closed position as shown in FIGS. 14b and 14c, which locks the DIMM in position in the slot 162 and also seats the DIMM in the slot.

(34) Referring to FIGS. 15a-15c, a sequence is shown regarding a method of removing the DIMM from the circuit board using the carrier 120. The release button 148 is depressed and the handling levers 140 swing open as shown in FIGS. 15a and 15b. The carrier 120 can then be removed from the housing in concert with the DIMM being removed from the slot of the connector by pulling the handling levers upwardly as shown in FIG. 15c.

(35) Thereby, the carrier assembly 100 according to the disclosure is provided which saves time and costs for servicing computer to replace component such as a DIMM. The carrier does not require a trained technician to remove and insert a card, because the DIMM is accessible through the outside of the outer casing of the computer. Another advantage of the present disclosure is that the carrier assembly decreases the amount of space required on the circuit board or a component, such as the DIMM, and its associated mechanism to lock into the housing. The carrier assembly 100 also minimizes risk of damaging other internal components as the individual carriers only engage the inside of the computer through the housing.

(36) While embodiments of the present invention has been particularly shown and described with respect to preferred embodiments thereof, it will be understood by those skilled in the art that changes in forms and details may be made without departing from the spirit and scope of the present application. It is therefore intended that the present invention not be limited to the exact forms and details described and illustrated herein, but falls within the scope of the appended claims.