An all-purpose cleaning composition comprised of by percentage weight: 1-3% Tetrapotassium Pyrophosphate, 1-3% Sodium Hexametaphosphate FG Fine, 7-10% Sodium Metasilicate Pentahydrate, 7-10% Trisodium Phosphate, 8-10% Sodium TriPolyPhosphate, 8-10% Caustic Soda, 9-11% Nonylphenol ethoxylate, 7-9% Glycol Ether, 1-3% D-Limonene, 3-5% Sodium Xylene Sulfonate and the balance of 43-50% water.

The invention pertains to degreasing compositions, process for producing and uses thereof. The composition comprises: from about 4% to about 16% by weight of the composition of a first anionic surfactant having HLB value less than 12; from about 1% to about 5% by weight of the composition of a second anionic surfactant having HLB value more than 12; from about 1% to about 4% by weight of the composition of a weak acid; from about 2% to about 6% by weight of the composition of urea; from about 1% to about 5% by weight of the composition of trisodium phosphate; about 1% to about 4% of the composition, of an inorganic base; and from about 60% by weight to about 90% by weight of the composition of water.

The invention pertains to degreasing compositions, process for producing and uses thereof. The composition comprises: from about 4% to about 16% by weight of the composition of a first anionic surfactant having HLB value less than 12; from about 1% to about 5% by weight of the composition of a second anionic surfactant having HLB value more than 12; from about 1% to about 4% by weight of the composition of a weak acid; from about 2% to about 6% by weight of the composition of urea; from about 1% to about 5% by weight of the composition of trisodium phosphate; about 1% to about 4% of the composition, of an inorganic base; and from about 60% by weight to about 90% by weight of the composition of water.

Disclosed herein is a borate-free, aqueous cleaning and treating composition including at least one metasilicate (A); at least one orthophosphate (B); at least one phosphate (C); at least one surfactant (D); and where the aqueous cleaning and treating composition has a pH value at 20 C. in a range from 11.0 to 12.8; and possesses a molar ratio of Si atoms to P atoms being from 0.75:1 to 1:0.75, based on the sum of the Si-containing metasilicates (A) and the sum of the P-containing orthophosphates (B), diphosphates (C) and triphosphates (C). Further disclosed herein are solid mixtures. Additionally disclosed herein are a method for cleaning and treating metallic substrates by using the compositions and a method of using the compositions to clean metallic substrates and treat metallic substrates by forming a Si-containing layer on the surface of the metallic substrates.

The invention pertains to degreasing compositions, process for producing and uses thereof. The composition comprises: from about 4% to about 16% by weight of the composition of a first anionic surfactant having HLB value less than 12; from about 1% to about 5% by weight of the composition of a second anionic surfactant having HLB value more than 12; from about 1% to about 4% by weight of the composition of a weak acid; from about 2% to about 6% by weight of the composition of urea; from about 1% to about 5% by weight of the composition of trisodium phosphate; about 1% to about 4% of the composition, of an inorganic base; and from about 60% by weight to about 90% by weight of the composition of water.

The invention pertains to degreasing compositions, process for producing and uses thereof. The composition comprises: from about 4% to about 16% by weight of the composition of a first anionic surfactant having HLB value less than 12; from about 1% to about 5% by weight of the composition of a second anionic surfactant having HLB value more than 12; from about 1% to about 4% by weight of the composition of a weak acid; from about 2% to about 6% by weight of the composition of urea; from about 1% to about 5% by weight of the composition of trisodium phosphate; about 1% to about 4% of the composition, of an inorganic base; and from about 60% by weight to about 90% by weight of the composition of water.