A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

According to one aspect of the present invention, there is provided an oil pressure sensor attachment structure including: the oil path body; the sensor case; and a fixing member which fixes the sensor case to the oil path body. The sensor case has a columnar portion which is disposed along a central axis extending in an up and down direction, and a flange portion which protrudes from the columnar portion to an outside in a radial direction. The fixing member has a fixing portion which comes into contact with the oil path body and is fixed thereto, and a pressing portion which comes into contact with the upper surface of the flange portion and presses the flanges portion against the oil path body. The fixing portion and the pressing portion are disposed with an interval therebetween.

An audio appliance includes a microphone transducer having an acoustically sensitive region to convert incident acoustic energy to a corresponding output signal and a barometric transducer having a pressure-responsive region to convert an ambient pressure to a corresponding output signal. The audio appliance also has an acoustic housing defining a chamber to fluidly couple the microphone transducer with the barometric transducer, together with a processor and a memory containing instructions. The instructions, when executed by the processor, cause the audio appliance to determine a presence or an absence of an ambient impairment to the microphone transducer based at least in part on the output signal from the barometric transducer. Responsive to a determined presence of an ambient impairment to the microphone transducer, the instructions, when executed by the processor, cause the audio appliance to mitigate effects of the ambient impairment.

A method of manufacturing a semiconductor structure includes receiving a substrate, receiving a heater, receiving an electrode, and receiving a sensing material. The substrate have a first surface, a second surface opposite to the first surface and a plurality of vias extending from the second surface toward the first surface and filled with a conductive or semiconductive material and a first oxide layer, the first oxide layer surrounding the conductive or semiconductive material in the plurality of vias, and a second oxide layer disposed over the first surface and the second surface. The heater is disposed within a membrane over the first surface of the substrate and electrically connected with the substrate. The electrode is over the heater and the membrane; and the sensing material covers a portion of the electrode.

The invention relates to a pressure sensor (1) comprising a pressure sensing arrangement (8) and a housing. The housing comprises an intermediate member (2) and a bottom part (3), wherein the intermediate member (2) comprises an aperture (4). The aperture (4) extends through the intermediate member (2), wherein the aperture (4) is on a first end (5) covered by a diaphragm (6) connected to the intermediate member (2). A second end (7) of the aperture (4) is covered by the bottom part (3) comprising the pressure sensing arrangement (8). Task of the invention is to provide a pressure sensor which allows a simplified and cost effective assembly and mounting. The task is solved in that the intermediate member (2) comprises a gripping surface (16) on an outer surface of the housing.

A connection adapter for connecting a process chamber to a measuring system, in particular to a pressure, density or temperature measuring system, which includes at least three ports, having a process port, the process port being connected or connectable to the process chamber, a measuring port, the measuring system being connected or connectable to the measuring port, and an access port, which includes a self-sealing coupling. The connection adapter, furthermore includes a line system, having lines and at least one closable shutoff device. The line system connecting the process port to the measuring port and the access port, the connection between the process port and the measuring port being blockable gas-tight with the aid of the shutoff device, and the access port being connected or connectable to the measuring port via the line system. A measuring apparatus having a connection adapter is also provided.

An audio appliance includes a microphone transducer having an acoustically sensitive region to convert incident acoustic energy to a corresponding output signal and a barometric transducer having a pressure-responsive region to convert an ambient pressure to a corresponding output signal. The audio appliance also has an acoustic housing defining a chamber to fluidly couple the microphone transducer with the barometric transducer, together with a processor and a memory containing instructions. The instructions, when executed by the processor, cause the audio appliance to determine a presence or an absence of an ambient impairment to the microphone transducer based at least in part on the output signal from the barometric transducer. Responsive to a determined presence of an ambient impairment to the microphone transducer, the instructions, when executed by the processor, cause the audio appliance to mitigate effects of the ambient impairment.

A physical quantity measuring device includes a cylindrical case provided with a through hole, a sensor module, a joint, a cap member, a circuit board including an electronic circuit and an electronic adjuster, a sealing member attached to the through hole, and an adjuster member capable of adjusting the electronic adjuster. The electronic adjuster includes an engaged portion disposed to face the through hole. The sealing member is provided with a housing recess opened to an outside of the cylindrical case, and a communication hole for bringing the housing recess into communication with an interior of the cylindrical case. The adjuster member includes a shaft that is hermetically attached in the communication hole, an engagement portion provided at a first end of the shaft to be engageable with the engaged portion, and an operable portion provided at a second end of the shaft and housed in the housing recess.

This application relates to a portable electronic device including a processor and an operational component assembly, the operational component assembly including a frame. The frame carries a sensor that is coupled to the frame, where the sensor is capable of (i) receiving an environmental stimulus, and (ii) subsequently, generating an environmental parameter based on the environmental stimulus. The operational components further include a speaker that includes a magnetic driver that is capable of generating a magnetic field in response to receiving the instructions, and a diaphragm that is capable of actuating in response to the magnetic field being generated by the magnetic driver. An opening is disposed at an external surface of the frame such that when an amount of moisture is present within the volume, the magnetic driver receives the instructions from the processor to generate a magnetic field that actuates the diaphragm so as to expel the moisture.

Certain improvements in thin film sensors are disclosed, with particular emphasis on aircraft applications. In certain embodiments, dielectric isolation washers have been provided between the pressure sensor and the interior surface of the exterior metal housing of the sensor assembly. In this manner, high voltage inputs from a lightning strike or other source that reach the sensor housing are not transmitted to the sensor. In one embodiment, the dielectric washers, insulators, and potting compounds isolate the metal thin film pressure sensor from all adjacent metal components in the assembly with non-conducting insulating materials like Torlon, zirconia and nylon. Besides their high dielectric strength, these materials exhibit excellent compressive strength and outstanding resistance to wear, creep and chemicals. Certain minimum thickness for these components are described. The present thin film pressure sensor embodiments can attain a dielectric rating of 1500 VAC.