A method of joining a brittle material to a component is provided. The method includes depositing a metallization layer on a surface of the brittle material. A layer of joining material is applied between the brittle material and the component, such that the component and the brittle material define an interface area. The metallization layer and the joining material layer extends beyond the interface area.

A process pressure transmitter system includes a process pressure transmitter housing and a process pressure sensor in the process pressure transmitter housing. A metal flange is configured to mount to a process vessel which carries a process fluid. An isolation diaphragm attaches to the metal flange and is exposed to the process fluid through an opening in the process vessel. The isolation diaphragm comprises a polymer diaphragm bonded to a metal face of the metal flange. A capillary passageway carries a fill fluid from the isolation diaphragm to thereby convey a process pressure to the pressure sensor.

Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and provide improved deflection of a sensor membrane, lamella or other movable element. In embodiments, a sensor comprises a support structure for a lamella, membrane or other movable element. The support structure comprises a plurality of support elements that hold or carry the movable element. The support elements can comprise individual points or feet-like elements, rather than a conventional interconnected frame, that enable improved motion of the movable element, easier removal of a sacrificial layer between the movable element and substrate during manufacture and a more favorable deflection ratio, among other benefits.

Transducer assemblies may include a sensor and a housing including a pass-through portion comprising at least one aperture in a portion of the housing extending along a longitudinal axis of the housing and the sensor. Methods of forming transducer assemblies may include welding a first housing section of the transducer assembly to a second housing portion of the transducer assembly and forming at least one aperture in the first housing section extending along a longitudinal axis of the transducer assembly, along a chamber for holding a sensor, and through the weld.

A dual range sensor apparatus includes a single pressure transducer element coupled to respective inputs of two discrete signal conditioning modules, or to both inputs of a multiple input signal conditioning module that is configured to condition the output signal of two transducer elements. The disclosed sensor apparatus outputs a pressure signal in a limited pressure range with very high accuracy, and also provides a pressure signal in a wider pressure range with the same accuracy that can be achieved with traditional pressure sensor configurations. The sensor apparatus may provide output on a single output node in a multiplexed output signal format. The multiplexed output signal format may include several digital output formats and may be provided on a single output pin of the sensor apparatus.

A device is provided for sensing a pressure of a fluid medium, having a pressure-sensing element disposed in a sensor housing, the sensor housing having a first housing part provided with a pressure connector in the form of a metallic threaded part, and a second housing part provided with an electrical connection, the first housing part at least sectionally having an outer case formed as an external drive. The first housing part is injection-molded as a plastic injection-molded part onto the pressure connector.

A semiconductor structure includes a substrate including a plurality of vias passing through the substrate and filled with a conductive or semiconductive material, and an oxide layer surrounding the conductive or semiconductive material, the substrate defining a cavity therein; a membrane disposed over the substrate and the cavity; a heater disposed within the membrane and electrically connected with the substrate; and a sensing electrode disposed over the membrane and the heater.

The present invention relates to a film comprising graphene oxide (GO) and clay, an electronic device comprising the film, a packaging material coated with the film, and a preparation method thereof.

A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

A method for inspecting a pressure pulse wave sensor is provided. The sensor chip includes a recess which is recessed in a direction perpendicular to the pressure-sensitive face, and the pressure-sensitive element array is formed in a portion of the sensor chip whose thickness is reduced in the direction due to the recess. The method includes: bonding and fixing the sensor chip onto the substrate so that the recess communicates with atmospheric air through only the through hole of the substrate; connecting a substrate-side terminal portion of the substrate and the chip-side terminal portion through an electrically conductive member; and performing characteristic evaluation on the sensor chip based on a signal outputted from the substrate-side terminal portion in a state in which air is sucked through the through hole of the substrate to thereby apply negative pressure to the pressure-sensitive face.