An advance pneumatic detector to indicate pressure changes in an environment includes a switch, a pressure tube, an endcap, a piston, and a magnet. The pressure tube is connected to the switch. The endcap is disposed on an end of the pressure tube opposite from the switch. The piston is disposed within and forms a seal against the pressure tube. The piston is slidably engaged with the pressure tube. The magnet is slidably attached to and surrounds a portion of the pressure tube. The magnet is configured to control the positioning of the piston within the pressure tube.

The design and manufacture method of a pressure sensor utilizing thermal field sensing with a thermal isolated membrane of a diaphragm structure is disclosed in the present invention. This device is made with silicon micromachining (a.k.a. MEMS, Micro Electro Mechanical Systems) process for applications of pressure measurement with large dynamic range, high accuracy and high stability during temperature variation. This device is applicable for all types of pressure metrology. The said thermal field pressure sensing device operates with thermistors on a membrane of the diaphragm structure made of silicon nitride with a heat isolation cavity underneath or a single side thermal isolated silicon nitride membrane with a reference cavity. This device can be seamlessly integrated with a thermal flow sensor with the same process.

The present disclosure relates to an apparatus and a method for evaluating a seat by using body pressure distribution. The apparatus includes: a body grid generator to generate body grids corresponding to body pressure data, which is measured while a driver is seated on a seat of a vehicle, based on the body pressure data and body information of the driver; a pressure analyzer to divide the body grids to a plurality of body grid areas based on body areas of the body pressure data and analyze the body pressure data included in the body grid areas; and a pressure evaluator to evaluate a body pressure for the seat based on the analyzed body pressure data of the body grid areas, and evaluate a hugging feeling of the driver for the seat based on the evaluated body pressure.

A pressure sensor includes: a first substrate having first and second diaphragms on one surface provided by first and second recesses on another surface; first and second detecting elements on the first and second diaphragms; a second substrate providing a first reference pressure chamber with the one surface of the first substrate; a third substrate providing a second reference pressure chamber sealing the second recess; and a calculator calculating an offset value by a difference between a reference signal and an inspection signal and detecting a pressure of a measurement medium by a difference between a detection signal and the offset value. The first detecting element outputs the detection signal or the inspection signal according to a pressure difference between a first reference pressure or a reference medium pressure and a measurement medium pressure in the first recess. The second detecting element outputs the reference signal according to a difference between the first reference pressure and and a second reference pressure.

A pressure measurement pod for blood circuits can include a flexible, moveable, fluid-impermeable diaphragm and can be formed via either a one-shot or a two-shot molding process. A method of manufacturing a pressure measuring device can include providing first and second major mold parts having recesses defining major parts of a housing, and inserting pins in the first and second major mold parts, the pins being shaped to define a flow channel of a molded pressure measuring pod. One of the pins may have a major face that defines an internal surface of a diaphragm. The method may further include closing the first and second major mold parts with the pins therebetween and injection molding a pressure pod housing. Finally, the pressure pod is removed from the mold parts and the pins are withdrawn from the flow channel.

Transducer assemblies may include a sensor and a housing including a pass-through portion comprising at least one aperture in a portion of the housing extending along a longitudinal axis of the housing and the sensor. Methods of forming transducer assemblies may include welding a first housing section of the transducer assembly to a second housing portion of the transducer assembly and forming at least one aperture in the first housing section extending along a longitudinal axis of the transducer assembly, along a chamber for holding a sensor, and through the weld.

Provided is a pressure detection device including: a pressure sensor including a pressure detection surface for detecting a pressure of a fluid; and a flow channel unit having a flow channel formed therein to guide the fluid to the pressure detection surface. The flow channel unit includes a flow channel body having the flow channel 21a formed therein, and an earth ring disposed in contact with the pressure sensor. The earth ring is formed of a conductive fluororesin material including a fluororesin material and a conductive material in which the fluororesin material is dispersed, and is maintained at a ground potential.

According to one embodiment, a strain sensing element is provided on a film unit configured to be deformed. The strain sensing element includes a functional layer, a first magnetic layer, a second magnetic layer, and a spacer layer. The functional layer includes at least one of an oxide and a nitride. The second magnetic layer is provided between the functional layer and the first magnetic layer. A magnetization of the second magnetic layer is variable in accordance with a deformation of the film unit. The spacer layer is provided between the first magnetic layer and the second magnetic layer. At least a part of the second magnetic layer is amorphous and includes boron.

A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device includes an ASIC wafer having a front side and a rear side, and a rewiring system, formed on the front side of the ASIC wafer, which includes a plurality of stacked strip conductor levels and insulation layers. The pressure sensor device also includes a MEMS wafer having a front side and a rear side, a first micromechanical functional layer which is formed above the front side of the MEMS wafer, and a second micromechanical functional layer which is formed above the first micromechanical functional layer.

A pressure sensor package includes a pressure sensor having a first side attached to a substrate and a second side opposite the first side, the first side having a pressure inlet aligned with an opening in the substrate, the second side having one or more electrical contacts. A logic die attached to an opposite side of the substrate as the pressure sensor is operable to process signals from the pressure sensor. First electrical conductors connect to the one or more electrical contacts of the pressure sensor. Second electrical conductors connect to one or more electrical contacts of the logic die. A mold compound completely encapsulates the second electrical conductors and at least partly encapsulates the logic die and the first electrical conductors. An open passage in the mold compound is aligned with the opening in the substrate so as to define a pressure port of the pressure sensor package.