An electronic device having a pressure sensor configured to determine pressure is disclosed. The electronic device includes an enclosure defining an internal volume. The enclosure may include a sidewall with an external opening that provides a vent for the internal components. To reduce the response of the pressure sensor (that is, the time required to detect a pressure change), the pressure sensor may secure with an internal wall of the enclosure. Further, the internal wall includes an opening defining an air pocket significantly smaller than the internal volume. When the pressure sensor is mounted to receive air via the air pocket, the pressure sensor may respond faster to pressure changes, as compared to receiving air circulating throughout the internal volume. This is due in part to an amount of airflow passing through the air pocket causing a greater pressure change throughout the air pocket as compared to the internal volume.

A sensing material for use in a sensor is disclosed. Such a sensing material includes a polymer base and a piezoresistive nanocomposite embedded into the polymer base in a continuous pattern. The nanocomposite comprises a polymer matrix and a plurality of conductive nanofillers suspended in the matrix. The conductive nanofillers may be one or a combination of nanotubes, nanowires, particles and flakes. The density of the plurality of nanofillers is such that the nanocomposite exhibits conductivity suitable for electronic and sensor applications.

A semiconductor structure includes a first device and a second device. The first device includes a first substrate, a plurality of vias passing through the first substrate and filled with a conductive or semiconductive material and a first oxide layer surrounding the conductive or semiconductive material, a cavity surrounded by the first substrate, a metallic material disposed over the first surface, a second oxide layer disposed over the second surface, a membrane disposed over the second oxide layer and the cavity, a heater disposed within the membrane, a sensing electrode disposed over the membrane and the heater, and a sensing material disposed over the cavity and contacting with the sensing electrode. The second device includes a second substrate, and a bonding structure disposed over the second substrate. The metallic material is bonded with the bonding structure to integrate the first device with the second device.

A stress-sensitive device includes a substrate having a first surface with a cavity defined therein and a three-dimensional deformable material extending along the first surface and into the cavity. The three-dimensional deformable material has an electrical characteristic responsive to deformation. A method of forming a three-dimensional stress-sensitive device includes providing a substrate having a first surface and a second surface opposite the first surface, forming a cavity in the substrate, wherein the cavity is open to the first surface, depositing a sacrificial layer in the cavity, depositing a deformable material on the sacrificial layer, and removing at least a portion of the sacrificial layer to form an interstitial space between the deformable material and the substrate in the cavity.

The present disclosure relates to a pressure measuring device configured to measure positive pressure and negative pressure. The pressure measuring device may comprise a sealing part, a ring configured to be in contact in use, and a protrusion.

One or more sensor devices are encapsulated on a top surface of a carrier substrate within an elastomer material. The carrier substrate includes one or more recessed channels adjacent to each sensor device which are filled by a portion of the elastomer material to create flanged areas that are level with the top surface of the carrier substrate. A cover which can include a liquid or gas input port or other related structures can be placed over each sensor device and bonded to the carrier substrate at the flanged areas, creating a seal between the cover and the carrier substrate that surrounds each sensor device.

A pipeline monitoring unit and method are disclosed. The unit includes a pressure monitoring unit couplable to a pipeline and arranged to monitor fluid pressure in the pipeline over time when coupled to the pipeline and generate data on the fluid pressure at a first sampling rate. A processing unit is arranged to process the data from the pressure monitoring unit to downsample at least a portion of the data from the pressure monitoring unit to a second sampling rate, the second sampling rate being less than the first sampling rate, to generate working data and monitor the samples in the working data for samples having predetermined characteristics to identify a transient event. Upon identifying a transient event, data including at least a portion of the data from the pressure monitoring unit having the first sampling rate is communicated to a remote system for analysis.

A semiconductor structure includes a first device and a second device. The first device includes a first substrate, a plurality of vias passing through the first substrate and filled with a conductive or semiconductive material and a first oxide layer surrounding the conductive or semiconductive material, a cavity surrounded by the first substrate, a metallic material disposed over the first surface, a second oxide layer disposed over the second surface, a membrane disposed over the second oxide layer and the cavity, a heater disposed within the membrane, a sensing electrode disposed over the membrane and the heater, and a sensing material disposed over the cavity and contacting with the sensing electrode. The second device includes a second substrate, and a bonding structure disposed over the second substrate. The metallic material is bonded with the bonding structure to integrate the first device with the second device.

A pressure measurement system for use in blood circuits comprised of a pressure sensing pod and a force measurement device. The pressure sensing pod can include a flexible, moveable, fluid-impermeable diaphragm and can be formed via either a one-shot or a two-shot molding process. A mechanical engagement member of the force measurement device engages with a mechanical engagement feature of the diaphragm, and the engagement member is operative to move in concert with movement of the engagement feature of the diaphragm based on pressure variations with the pressure sensing pod. The force measurement device generates and outputs to a processor a signal based on detected force associated with movement of the engagement member.

A pressure measurement system for use in blood circuits comprised of a pressure sensing pod and a force measurement device. The pressure sensing pod can include a flexible, moveable, fluid-impermeable diaphragm and can be formed via either a one-shot or a two-shot molding process. A mechanical engagement member of the force measurement device engages with a mechanical engagement feature of the diaphragm, and the engagement member is operative to move in concert with movement of the engagement feature of the diaphragm based on pressure variations with the pressure sensing pod. The force measurement device generates and outputs to a processor a signal based on detected force associated with movement of the engagement member.