A connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip is provided. The connector comprises: a curved mirror; and a tilted flat mirror; wherein at least one of the curved mirror and the tilted flat mirror is formed on a hardened stamped imprint material that was deposited on the SiPh chip at least in a cavity thereof.

Optical ports providing passive alignment connectivity are disclosed. In one embodiment, an optical port includes a substrate having a surface, a photonic silicon chip, a connector body, and a plurality of spacer elements. The photonic silicon chip includes an electrical coupling surface, an upper surface and an optical coupling surface. The optical coupling surface is positioned between the electrical coupling surface and the upper surface. The photonic silicon chip further includes at least one waveguide terminating at the optical coupling surface, and a chip engagement feature disposed on the upper surface. The connector body includes a first alignment feature, a second alignment feature, a mounting surface, and a connector engagement feature at the mounting surface. The connector engagement feature mates with the chip engagement feature. The plurality of spacer elements is disposed between the electrical coupling surface of the photonic silicon chip and the surface of the substrate.

An optical assembly includes an optical ferrule configured to receive an input light ray through an input location on a major input surface of the optical ferrule along a first direction for coupling to an optical waveguide secured to the optical ferrule, the optical ferrule including a reference location, such that a change in a temperature of the optical assembly causes the input light ray and the input location, but not the reference location, to move respective distances d1 and d2 along a same direction along a same axis, wherein a magnitude of dl-d2 is δ, and a maximum of magnitudes of d1 and d2 is greater than 10 times δ.

An optical connector holding one or more optical ferrule assembly is provided. The optical connector includes an outer body, an inner front body accommodating the one or more optical ferrule assembly, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four optical ferrule assembly are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight optical ferrule assembly are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A receptacle can hold one or more connector inner bodies forming a single boot for all the optical fibers of the inner bodies.

An illumination apparatus, which is to be connected to a light source apparatus that generates laser light and which is to be attached to an optical cable that guides the laser light, is provided. The illumination apparatus includes a light-emitting module which is to be attached to a tip portion of the optical cable. The light-emitting module receives the laser light emitted from the optical cable, converts the laser light into light having a different wavelength of a predetermined color, and emits the light. A heat dissipating lens case includes a lens and dissipates heat generated by the light-emitting module. The lens controls distribution of the light emitted by the light-emitting module. The heat dissipating lens case includes an attachment structure which allows the heat dissipating lens case to be removably attached to the light-emitting module.

An apparatus includes a dielectric support substrate with one or more planar major surfaces and one or more optical fiber interfaces fixed to the support substrate adjacent one of the one or more planar major surfaces. Each optical fiber interface has optical modulators and photodetectors. The apparatus also includes one or more digital signal processing chips fixed to the support substrate adjacent one of the one or more planar major surfaces, and laterally separated from and communicatively connected via metallic lines to the one or more optical fiber interfaces. The apparatus also includes a first set of one or more metallic heatsinks adjacent the one or more digital signal processing chips to provide heat dissipation therefrom. The apparatus also includes a second set of one or more metallic heatsinks being located adjacent the one or more optical fiber interfaces to provide heat dissipation therefrom and physically separated by a distance from the one or more metallic heatsinks of the first set.

A blood coagulation analyzer comprises: a light irradiation unit configured to apply light onto a container configured to store a measurement specimen containing a sample and a reagent, and comprising: light sources including a first light source configured to generate light of a first wavelength for blood coagulation time measurement, a second light source configured to generate light of a second wavelength for synthetic substrate measurement, and a third light source configured to generate light of a third wavelength for immunonephelometry measurement; and optical fiber parts facing the respective light sources; a light reception part configured to receive light transmitted through the container; and an analysis unit configured to analyze the sample using an electric signal outputted from the light reception part.

A first chip includes a first plurality of optical waveguides exposed at a facet of the first chip. A second chip includes a second plurality of optical waveguides exposed at a facet of the second chip. The second chip includes first and second spacers on opposite sides of the second plurality of optical waveguides. The first and second spacers have respective alignment surfaces oriented substantially parallel to the facet of the second chip at a controlled perpendicular distance away from the facet of the second chip. The second chip is positioned with the alignment surfaces of the first and second spacers contacting the facet of the first chip, and with the second plurality of optical waveguides respectively aligned with the first plurality of optical waveguides. The first and second spacers define and maintain an air gap of at least micrometer-level precision between the first and second pluralities of optical waveguides.

An optical connector is characterized by having an optical coupling member (10) provided with a holder (11) where a storage portion to store a ball lens (12) is formed at one end, and an insertion hole to insert an optical fiber (13) is formed at the other end, and a magnet (14) which is provided outside in a direction crossing a storage direction of the ball lens at one end of the holder, and generates an adsorption force to align the center of the ball lens with the center of an optical element provided in a coupling target, a guide member (2) which regulates a shift of the optical coupling member, while permitting alignment operation of the optical coupling member with the coupling target, and a case (4) in which is formed storage space (4a) with an opening, and which is provided with a second adsorption member (15) for generating an adsorption force to an end face on the coupling target side.

An interposer for coupling an optical conduit to an optical component, said interposer comprising: (a) an optical component; (b) a first lens component having a first lens; (c) a second lens component having a second lens, said first and second lenses being configured to define an expanded-beam coupling therebetween; (d) at least one reflective surface optically coupled with said second lens; (e) a first optical path at least partially defined between said optical component and said first lens to accommodate a diverging light beam from said optical component to said first lens; (f) a second optical path at least partially defined between said second lens and said at least one reflective surface to accommodate a converging light beam from said second lens and said at least one reflective surface; and (g) a separable interface along said second optical path or at said expanded-beam coupling.