A display device includes: a substrate including a display area and a peripheral area; a first conductive layer on the substrate in the peripheral area; an insulation layer covering the first conductive layer; and a second conductive layer on the insulation layer in the peripheral area, the second conductive layer including a plurality of first holes, wherein the first conductive layer does not overlap the first holes of the second conductive layer.

A display device and a method for manufacturing a display device are disclosed. The display device may prevent a leakage current from occurring between adjacent pixels. The display device comprises a substrate, a first electrode provided in each of a first subpixel and a second subpixel arranged to be adjacent to the first subpixel, on the substrate, a trench provided between the first subpixel and the second subpixel, a light emitting layer provided in each of the first subpixel and the second subpixel on the first electrode, a second electrode provided in each of the first subpixel and the second subpixel on the light emitting layer, and a third electrode electrically connecting the second electrode provided in the first subpixel with the second electrode provided in the second subpixel. The second electrode is disconnected between the first subpixel and the second subpixel by the trench.

A method of manufacturing a tiled display device is provided. In the method of manufacturing a tiled display device, a plurality of display panels are provided. Next, a plurality of alignment marks are provided. Afterwards, the plurality of display panels are tiled with reference to the plurality of alignment marks. The alignment marks are so arranged that the display panels are tiled to make all the same interpitches.

A display panel, a display device, and a manufacturing method of the display panel are disclosed. The display panel includes an array substrate and a light-emitting function layer disposed on the array substrate. The display panel includes a display area and a sensor light-receiving area adjacent to the display area. The array substrate includes a thin film transistor array disposed in the display area, the light-emitting function layer is disposed in the display area and the sensor light-receiving area, and the thin film transistor array is electrically connected to the light-emitting function layer.

The present invention provides a display panel, a manufacturing method thereof and a display apparatus. The display panel includes a substrate, a light-emitting element, and a pixel defining layer. The light-emitting element includes a cathode, an anode and a light-emitting layer, the pixel defining layer defines a plurality of openings, the light-emitting layer is disposed in the openings and covers a predetermined area on a side of the pixel defining layer facing towards the openings, and hydrophilicity of the pixel defining layer at each position of the predetermined area is substantially identical.

Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a display area, a mounting hole located in the display area, and an encapsulation region located between the display area and the mounting hole. The encapsulation region includes an insulating layer, an encapsulation pixel definition layer arranged on the insulating layer, and a partition structure layer arranged on the encapsulation pixel definition layer. The encapsulation pixel definition layer includes multiple spaced protrusions, the partition structure layer includes multiple spaced columns, the columns are arranged on the protrusions, a functional layer is arranged on the multiple spaced columns, and the functional layer is broken by the columns.

The present disclosure provides a display backplane, a method for manufacturing the same and a full-screen fingerprint identification display device. The display backplane includes a substrate; a circuit layer disposed on a surface of the substrate; a light emitting device layer disposed on a surface of the circuit layer away from the substrate; and a plurality of fingerprint identification photodetectors disposed in at least one of the circuit layer and the light emitting device layer.

A method of manufacturing a display panel includes providing an insulating substrate that includes a hole area, a display area that surrounds the hole area, and a peripheral area adjacent to the display area, forming a semiconductor pattern in the display area, forming an insulating layer, forming contact holes in the insulating layer that expose portions of the semiconductor pattern, and forming a module hole by etching a portion of the insulating layer and a portion of the insulating substrate that overlap the hole area.

Disclosed are a display substrate and a manufacturing method therefor, and a display panel and a display device. The arrangement of a first isolation portion and a second isolation portion at least disconnects a first isolated portion from one of a second isolated portion and a third isolated portion; therefore, the effect of isolating a cathode can be enhanced when an isolated layer is the cathode multiplexed into a self-capacitance electrode; and when the isolated layer is an inorganic film encapsulation layer contained in a bezel area, cracks generated by cutting or for other reasons may be prevented from extending to a display area.

A display substrate motherboard has display areas and at least one cutting area located at least among the display areas. The display substrate motherboard includes a base substrate, first barrier groups disposed on the base substrate, an inert material layer and a first inorganic insulating layer. Each first barrier group is located on at least one side of a corresponding display area and includes two first barriers. A region between the two first barriers is located in a cutting area. The inert material layer is disposed in the region. The first inorganic insulating layer is disposed on a side of the first barrier groups away from the base substrate, and is further located in the display areas. An orthogonal projection of the first inorganic insulating layer on the base substrate is non-overlapping with an orthogonal projection of the inert material layer on the base substrate.