An antenna includes a first radiating element configured to emit first electromagnetic radiation in response to at least one feed signal having a frequency within a first radio frequency (RF) band. A director is provided, which is positioned forwardly of the first radiating element, and in a path of the first electromagnetic radiation. The director includes first and second passive impedance elements that provide respective first and second frequency-dependent reactances to first currents induced within the director in response to the first electromagnetic radiation. The first and second passive impedance elements may include a first inductor and a first capacitor, which are electrically coupled in series. The director may also be configured to include a plurality of passive impedance elements that are connected within an impedance loop containing a second LC circuit in series with a first LC circuit.

An antenna board includes a first base board unit including a first insulating layer having a first receiving groove; a first antenna board unit disposed in the first receiving groove, including a second insulating layer and a third insulating layer disposed on the second insulating layer, and further including at least one of a first patch pattern disposed on the second insulating layer and covered by the third insulating layer and a second patch pattern disposed on the third insulating layer; and a first encapsulant covering at least a portion of the first antenna board unit and filling at least a portion of the first receiving groove, wherein a dielectric constant of the second insulating layer is different from a dielectric constant of the third insulating layer.

An antenna board includes a first base board unit including a first insulating layer having a first receiving groove; a first antenna board unit disposed in the first receiving groove, including a second insulating layer and a third insulating layer disposed on the second insulating layer, and further including at least one of a first patch pattern disposed on the second insulating layer and covered by the third insulating layer and a second patch pattern disposed on the third insulating layer; and a first encapsulant covering at least a portion of the first antenna board unit and filling at least a portion of the first receiving groove, wherein a dielectric constant of the second insulating layer is different from a dielectric constant of the third insulating layer.

An earphone module includes an antenna structure. The antenna structure includes a first radiator, a second radiator, a conductive member, and a first insulating member. The first radiator includes a feeding end. The second radiator includes a ground end, and a first slot is formed between the first radiator and the second radiator. The conductive member is connected to the first radiator and the second radiator. The first insulating member is disposed in the first slot. The first radiator, the second radiator, the conductive member, and the first insulating member collectively serve as at least a part of a shell of the earphone module.

An earphone module includes an antenna structure. The antenna structure includes a first radiator, a second radiator, a conductive member, and a first insulating member. The first radiator includes a feeding end. The second radiator includes a ground end, and a first slot is formed between the first radiator and the second radiator. The conductive member is connected to the first radiator and the second radiator. The first insulating member is disposed in the first slot. The first radiator, the second radiator, the conductive member, and the first insulating member collectively serve as at least a part of a shell of the earphone module.

A 5.sup.th generation (5G) or pre-5G communication system for supporting a higher data transfer rate than 4.sup.th generation (4G) communication systems such as long term evolution (LTE). An apparatus for radiating a signal in a wireless communication system may include: a power amplifier; an antenna; and a combine filter unit configured to transfer an output signal of the power amplifier to the antenna. The combine filter unit may include: a first impedance matching circuit; a second impedance matching circuit; and a plurality of filters coupled in parallel between the first impedance matching circuit and the second impedance matching circuit. Allowable power of each of the plurality of filters may be lower than a maximum and/or predetermined power output of the power amplifier.

A 5.sup.th generation (5G) or pre-5G communication system for supporting a higher data transfer rate than 4.sup.th generation (4G) communication systems such as long term evolution (LTE). An apparatus for radiating a signal in a wireless communication system may include: a power amplifier; an antenna; and a combine filter unit configured to transfer an output signal of the power amplifier to the antenna. The combine filter unit may include: a first impedance matching circuit; a second impedance matching circuit; and a plurality of filters coupled in parallel between the first impedance matching circuit and the second impedance matching circuit. Allowable power of each of the plurality of filters may be lower than a maximum and/or predetermined power output of the power amplifier.

Single band and multiband wireless antennas are an important element of wireless systems. Competing tradeoffs of overall footprint, performance aspects such as impedance matching and cost require not only consideration but become significant when multiple antenna elements are employed within a single antenna such as to obtain circular polarization transmit and/or receive. Accordingly, it would be beneficial to provide designers of a wide range of electrical devices and systems with compact single or multiple frequency band antennas which, in addition to providing the controlled radiation pattern and circular polarization purity (where required) are impedance matched without substantially increasing the footprint of the antenna and/or the complexity of the microwave/RF circuit interfaced to them, whilst supporting multiple signals to/from multiple antenna elements in antennas employing them. Solutions present achieve this through provisioning one or more capacitive series reactances discretely or in combination with one or more shunt capacitive reactances.

Single band and multiband wireless antennas are an important element of wireless systems. Competing tradeoffs of overall footprint, performance aspects such as impedance matching and cost require not only consideration but become significant when multiple antenna elements are employed within a single antenna such as to obtain circular polarization transmit and/or receive. Accordingly, it would be beneficial to provide designers of a wide range of electrical devices and systems with compact single or multiple frequency band antennas which, in addition to providing the controlled radiation pattern and circular polarization purity (where required) are impedance matched without substantially increasing the footprint of the antenna and/or the complexity of the microwave/RF circuit interfaced to them, whilst supporting multiple signals to/from multiple antenna elements in antennas employing them. Solutions present achieve this through provisioning one or more capacitive series reactances discretely or in combination with one or more shunt capacitive reactances.

Disclosed herein is an antenna module that includes solder balls provided on a surface of the element body having an antenna element. The solder balls include a signal ball disposed at an intersection between the second row virtual line and the second column virtual line and first to fourth ground balls disposed, out of a plurality of intersections between the first to third row virtual lines and the first to third column virtual lines, at any of intersections other than those at which the signal ball is disposed. No solder ball is disposed, out of the intersections between the plurality of row and column virtual lines, at least at some of the plurality of intersections other than those at which the first signal ball or first to fourth ground balls are disposed.