Patent classifications
B23K11/02
TEMPERATURE SENSOR
Method for the manufacture of a temperature sensor with a thermocouple comprising the following successive steps: a) introduction, in a support tube made of a ceramic material, of two thermocouple wires until they extend beyond said support tube; b) welding the ends of said thermocouple wires extending beyond said support tube so as to form a thermocouple hot point; c) introduction, at least partially, of the support tube into a reinforcement tube made of a stainless steel; d) fixing a cap onto said reinforcement tube so as to protect said hot point.
HOMOPOLOR GENERATOR PULSED WELDING GENERATOR SUBSYSTEMS
Described herein are methods and system for welding, for example, girders. The method may include activating a homopolar generator. The method may include applying a force to two metal girders at a desired coupling joint. The method may include generating an electrical pulse using the homopolar generator and conducting the electrical pulse to the desired coupling joint to increase a temperature of the girders. The method may include forming a weld at the desired coupling joint attaching the two metal girders at the desired coupling joint. In some embodiments, the homopolar generator may include a radial bearing rotor including a rotatable shaft and a bearing assembly. The bearing assembly may include nonmagnetic bearings. The homopolar generator may include a field coil. The homopolar generator may include a brush actuation mechanism which when activated engages a plurality of brush devices to the radial bearing rotor.
HOMOPOLOR GENERATOR PULSED WELDING GENERATOR SUBSYSTEMS
Described herein are methods and system for welding, for example, girders. The method may include activating a homopolar generator. The method may include applying a force to two metal girders at a desired coupling joint. The method may include generating an electrical pulse using the homopolar generator and conducting the electrical pulse to the desired coupling joint to increase a temperature of the girders. The method may include forming a weld at the desired coupling joint attaching the two metal girders at the desired coupling joint. In some embodiments, the homopolar generator may include a radial bearing rotor including a rotatable shaft and a bearing assembly. The bearing assembly may include nonmagnetic bearings. The homopolar generator may include a field coil. The homopolar generator may include a brush actuation mechanism which when activated engages a plurality of brush devices to the radial bearing rotor.
ELECTRICAL BONDING METHOD AND ELECTRICAL BONDING APPARATUS
To bond bonding target members stacked on top of each other without generating dust or spatter into an electrically bonded article with improved mechanical strength against strong vibration etc. A first bonding target member or second bonding target member includes a relative displacement amount setting portion for setting the distance by which the bonding target portion of the first member and the bonding target portion of the second member are relatively displaced during bonding, and a current conduction suppressing layer is formed on the relative displacement amount setting portion. The second or first member includes a setting face that is placed opposed to the current conduction suppressing layer of the first or second member. In a state where the first and second members have been positioned, the distance between the current conduction suppressing layer and the setting face is equal to the width H of the bonded portion.
ELECTRICAL BONDING METHOD AND ELECTRICAL BONDING APPARATUS
To bond bonding target members stacked on top of each other without generating dust or spatter into an electrically bonded article with improved mechanical strength against strong vibration etc. A first bonding target member or second bonding target member includes a relative displacement amount setting portion for setting the distance by which the bonding target portion of the first member and the bonding target portion of the second member are relatively displaced during bonding, and a current conduction suppressing layer is formed on the relative displacement amount setting portion. The second or first member includes a setting face that is placed opposed to the current conduction suppressing layer of the first or second member. In a state where the first and second members have been positioned, the distance between the current conduction suppressing layer and the setting face is equal to the width H of the bonded portion.
Planar Heat Pipe
A planar heat pipe includes a container having a hollow portion provided at a central portion thereof with two opposing plate-shaped bodies, and a working fluid enclosed in the hollow portion. The hollow portion is provided with a wick structure. At least one of the plate-shaped bodies is a composite member of two or more types of metal members that are laminated and integrated. A metal member of the composite member forming a layer that contacts the hollow portion has a thermal conductivity of greater than or equal to 200 W/m.Math.K and a metal member of the composite member forming a layer that contacts an exterior has a thermal conductivity of less than or equal to 100 W/m.Math.K, a peripheral portion of the hollow portion being sealed.
Planar Heat Pipe
A planar heat pipe includes a container having a hollow portion provided at a central portion thereof with two opposing plate-shaped bodies, and a working fluid enclosed in the hollow portion. The hollow portion is provided with a wick structure. At least one of the plate-shaped bodies is a composite member of two or more types of metal members that are laminated and integrated. A metal member of the composite member forming a layer that contacts the hollow portion has a thermal conductivity of greater than or equal to 200 W/m.Math.K and a metal member of the composite member forming a layer that contacts an exterior has a thermal conductivity of less than or equal to 100 W/m.Math.K, a peripheral portion of the hollow portion being sealed.
Bonding method
A method of bonding a first article to a second article, each article having a respective bond surface. The method comprises interposing a porous interlayer region between the bond surfaces of the first and second articles and subsequently using electrical resistance heating to locally heat the interlayer region under contact pressure to a bonding temperature below the melting temperature of the interlayer and the first and second articles to thereby bond the interlayer to the first and second articles to form a bonded article. The interlayer has a porosity of between approximately 10% and 30%.
Bonding method
A method of bonding a first article to a second article, each article having a respective bond surface. The method comprises interposing a porous interlayer region between the bond surfaces of the first and second articles and subsequently using electrical resistance heating to locally heat the interlayer region under contact pressure to a bonding temperature below the melting temperature of the interlayer and the first and second articles to thereby bond the interlayer to the first and second articles to form a bonded article. The interlayer has a porosity of between approximately 10% and 30%.
BONDED ARTICLE AND METHOD FOR MANUFACTURING BONDED ARTICLE
A method for manufacturing a bonded article having long bonding length and high strength. A first bonding target member and a second bonding target member having a hole portion for receiving the first member are provided. Pressing force is applied between the two members with the first member received in the hole portion, and a current is applied to a bonding target portion between the two members with the pressing force applied. The two members are of materials with different melting points. One of the two members, having lower melting point, has a heat capacity increasing portion in the vicinity of the target portion. The one of the members has a taper face at the target portion, and the heat capacity increasing portion has a face extending from the taper face. The force applying step is performed with the other member positioned not to contact the heat capacity increasing portion.