B81C2201/0174

Microelectromechanical microphone with membrane trench reinforcements and method of fabrication

A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS microphone includes a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate. The stoppage member limits motion of the flexible plate. The rigid plate includes a reverse bending edge that includes a first lateral etch stop that includes a first corner radius and a second corner radius. The first corner radius is more than 100 nanometers and the second corner radius is more than 25 nanometers. Further, a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.

Electrical contacts using an array of micromachined flexures

A contact having a first contact member having an exposed surface, the exposed surface having irregularities, undulations, or asperities that form one or more high points and low points on the exposed surface, a second contact member having a contact base surface, a plurality of electrically conductive flexures extending from the contact base surface, and when the first contact member is positioned adjacent to the second contact member in a closed position in which the contact base surface of the second contact member is not in electrical contact with the one or more high points on the exposed surface of the first contact member, each flexure of the plurality of flexures is in electrical contact with the exposed surface of the first contact member.

MICRO-ELECTRO-MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
20250074764 · 2025-03-06 ·

A micro-electro-mechanical system and a manufacturing method thereof. The micro-electro-mechanical system includes a comb tooth structure, a spring structure, and an electrode structure. The comb tooth structure includes first comb teeth and second comb teeth arranged alternately. A cantilever beam connecting the second comb teeth is connected to the spring structure; line widths of a first comb tooth and a second comb tooth are 3-7 microns, and are not less than a distance between the adjacent first comb tooth and the second comb tooth a ratio of the length of the first comb tooth to a length of the second comb tooth is 0.7-1.5, a width of the cantilever beam is not less than the line width of the second comb tooth, and thickness of the first comb tooth and a thickness of the second comb tooth are both 300 nanometers to 500 microns.

MICROSCALE FLEXIBLE STRAIN SENSOR
20250122073 · 2025-04-17 · ·

Disclosed herein are devices comprising stretchable interdigitated electrode arrays and methods for fabricating the devices. The devices are capable of acting as elongation sensors by sensing a change in the capacitance of the device as the distance between the interdigitated fingers changes when the device is elongated or compressed. The device may be coupled to other devices such as to be able to sense elongation or compression of the coupled device. The interdigitated fingers of the device are supported by a substrate and may be fabricated using traditional microfabrication techniques.

Membrane Device Fabrication
20250136437 · 2025-05-01 ·

A method of forming a membrane of a semiconductor membrane device is provided. The method includes providing a silicon on insulator (SOI) substrate having an active silicon layer, a buried oxide (BOX) layer, and a handle wafer. The method further includes determining a membrane area of said substrate, locally removing said BOX layer in at least a part of said membrane area, providing one or more dielectric layers on said active silicon layer, and etching said substrate to form said membrane that includes said one or more dielectric layers in said membrane area. Said etching includes an anisotropic etch through said handle wafer and said active silicon layer using an etch mask defining an etch area, and said etch area overlaps at least a part of said membrane area.

Signal processing circuit for triple-membrane MEMS device

A triple-membrane MEMS device includes a first membrane, a second membrane and a third membrane spaced apart from one another, wherein the second membrane is between the first membrane and the third membrane, a sealed low pressure chamber between the first membrane and the third membrane, a first stator and a second stator in the sealed low pressure chamber, and a signal processing circuit configured to read-out output signals of the triple-membrane MEMS device.

MICROELECTROMECHANICAL COMPONENT WITH A METAL STANDOFF
20250178887 · 2025-06-05 ·

A microelectromechanical component is provided with a metal standoff and a method of manufacturing the same. The metal standoff provides an accurate control of the MEMS gap height during the eutectic bonding of the component as well as mechanical stress reduction of the electrical contact.

MANUFACTURING METHOD FOR MICRO-ELECTRO-MECHANICAL MICROPHONE
20250187908 · 2025-06-12 ·

Provided is a manufacturing method for a micro-electro-mechanical microphone, including: providing a substrate, and forming a first baffle on the substrate; forming a diaphragm at a side of the first baffle, an orthographic projection of a periphery of the diaphragm towards the first baffle falling onto the first baffle; forming a second baffle at a side of the diagram at an interval, the second baffle being connected to the first baffle, and an orthographic projection of the second baffle towards the diaphragm at least partially falling onto a periphery of the diaphragm; forming a back-plate at a side of the second baffle at an interval, the back-plate including acoustic through-holes; and etching the substrate to form a back-cavity. The manufacturing method aims to improve a degree of freedom of the diaphragm to improve sensitivity of the micro-electro-mechanical microphone while improving the structural strength of the diaphragm.

SEALED CAVITY FOR A CAPACITIVE SENSING DEVICE
20250282608 · 2025-09-11 ·

A sealed cavity for a capacitive sensing device is presented herein. A micro-electro-mechanical system sensor comprises a capacitive sense element comprising a backplate and a diaphragm, in which the backplate comprises a first backplate portion and a second backplate portion, the diaphragm comprises a first diaphragm portion and a second diaphragm portion, the first backplate portion comprises an electrode of the capacitive sense element, and the capacitive sense element converts an external pressure that has been applied to the diaphragm into an electrical signal; and a sealed cavity that has been formed between the backplate and the diaphragm.

MICROELECTROMECHANICAL SYSTEMS DEVICE AND MANUFACTURING METHOD THEREOF

A microelectromechanical systems (MEMS) device including a substrate, a membrane layer and a plurality of patterned backplates is provided. The membrane layer is disposed on the substrate and has a plurality of corrugated structures. A top surface of the membrane layer has a rounded-corner feature, and a bottom surface of the membrane layer has a sharp-corner feature. The plurality of patterned backplates are disposed above the membrane layer. A manufacturing method of a MEMS device is also provided.