B81C2201/0174

MICROMECHANICAL DEVICE AND METHOD FOR PRODUCING A MICROMECHANICAL DEVICE HAVING A MEMS SUBSTRATE AND A CAP SUBSTRATE AND A CAVERN ENCLOSED BY MEMS SUBSTRATE AND CAP SUBSTRATE
20250346484 · 2025-11-13 ·

A micromechanical device and a method for producing a micromechanical device. The micromechanical device includes a MEMS substrate, a functional layer, and a cap part. The functional layer is located between the MEMS substrate and the cap part. The cap part includes a cap substrate. The micromechanical device has a main extension plane. The micromechanical system and the cap part enclose a cavern. The micromechanical device has a sealed cavern access.

MEMS SENSOR ARRANGEMENT AND METHOD FOR MANUFACTURING A MEMS SENSOR ARRANGEMENT
20260035236 · 2026-02-05 ·

In an embodiment a MEMS sensor arrangement includes a substrate, a pressure sensor structure and a sound transducer structure in a vertically stacked and mechanically coupled configuration, wherein the pressure sensor structure is arranged between the substrate and the sound transducer structure and a through-opening extending through the substrate and the pressure sensor structure and forming a sound-port for the sound transducer structure, wherein the sound transducer structure spans the through-opening, and wherein the pressure sensor structure comprises a pressure sensor element, which is in fluidic connection with the through-opening.

ACCELEROMETER WITH BIAS REDUCTION FEATURE
20260062283 · 2026-03-05 ·

An accelerometer system including: a housing comprising a first portion and a second portion, the housing has a first coefficient of thermal expansion (CTE) value; and a proof mass element disposed between the first portion and the second portion of the housing, wherein a first surface of the proof mass element contacts the first portion and a second surface of the proof mass element contacts the second portion, the proof mass element having a second CTE value, the second CTE value being within 30% of the first CTE value.

MEMS bump stopper surface features

A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.