H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/02
Manufacture or treatment of semiconductor devices or of parts thereof
H01L21/02
Manufacture or treatment of semiconductor devices or of parts thereof
H01L21/04
the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
H01L21/04
the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
H01L21/50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326,; e.g. sealing of a cap to a base of a container
H01L21/50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326,; e.g. sealing of a cap to a base of a container
H01L21/56
Encapsulations, e.g. encapsulation layers, coatings
H01L21/56
Encapsulations, e.g. encapsulation layers, coatings
H01L21/563
Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
H01L21/563
Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate