H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/70
Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
H01L21/70
Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
H01L21/71
Manufacture of specific parts of devices defined in group H01L21/70
H01L21/71
Manufacture of specific parts of devices defined in group H01L21/70
H01L21/768
Applying interconnections to be used for carrying current between separate components within a device; comprising conductors and dielectrics
H01L21/768
Applying interconnections to be used for carrying current between separate components within a device; comprising conductors and dielectrics
H01L21/76801
characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
H01L21/76801
characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
H01L21/76829
characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
H01L21/76829
characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
H01L21/76834
formation of thin insulating films on the sidewalls or on top of conductors
H01L21/76834
formation of thin insulating films on the sidewalls or on top of conductors