H
ELECTRICITY
H
ELECTRICITY
H01
ELECTRIC ELEMENTS
H01
ELECTRIC ELEMENTS
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/02
Bonding areas; Manufacturing methods related thereto
H01L2224/02
Bonding areas; Manufacturing methods related thereto
H01L2224/03
Manufacturing methods
H01L2224/03
Manufacturing methods
H01L2224/034
by blanket deposition of the material of the bonding area
H01L2224/034
by blanket deposition of the material of the bonding area
H01L2224/03444
in gaseous form
H01L2224/03444
in gaseous form
H01L2224/0345
Physical vapour deposition [PVD], e.g. evaporation, or sputtering
H01L2224/0345
Physical vapour deposition [PVD], e.g. evaporation, or sputtering