H
ELECTRICITY
H
ELECTRICITY
H01
ELECTRIC ELEMENTS
H01
ELECTRIC ELEMENTS
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/02
Bonding areas; Manufacturing methods related thereto
H01L2224/02
Bonding areas; Manufacturing methods related thereto
H01L2224/07
Structure, shape, material or disposition of the bonding areas after the connecting process
H01L2224/07
Structure, shape, material or disposition of the bonding areas after the connecting process
H01L2224/08
of an individual bonding area
H01L2224/08
of an individual bonding area
H01L2224/081
Disposition
H01L2224/081
Disposition
H01L2224/0812
the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
H01L2224/0812
the bonding area connecting directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
H01L2224/08135
the bonding area connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
H01L2224/08135
the bonding area connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
H01L2224/08145
the bodies being stacked
H01L2224/08145
the bodies being stacked
H01L2224/08146
the bonding area connecting to a via connection in the body
H01L2224/08146
the bonding area connecting to a via connection in the body