H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/18
High density interconnect [HDI] connectors; Manufacturing methods related thereto
H01L2224/18
High density interconnect [HDI] connectors; Manufacturing methods related thereto
H01L2224/23
Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
H01L2224/23
Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
H01L2224/24
of an individual high density interconnect connector
H01L2224/24
of an individual high density interconnect connector
H01L2224/2499
Auxiliary members for HDI interconnects, e.g. spacers, alignment aids
H01L2224/2499
Auxiliary members for HDI interconnects, e.g. spacers, alignment aids