H
ELECTRICITY
H
ELECTRICITY
H01
ELECTRIC ELEMENTS
H01
ELECTRIC ELEMENTS
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/42
Wire connectors; Manufacturing methods related thereto
H01L2224/42
Wire connectors; Manufacturing methods related thereto
H01L2224/47
Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/47
Structure, shape, material or disposition of the wire connectors after the connecting process
H01L2224/48
of an individual wire connector
H01L2224/48
of an individual wire connector
H01L2224/484
Connecting portions
H01L2224/484
Connecting portions
H01L2224/48463
the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
H01L2224/48463
the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
H01L2224/48465
the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
H01L2224/48465
the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch