H01L23/48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements; ; Selection of materials therefor
H01L23/48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements; ; Selection of materials therefor
H01L23/488
consisting of soldered; or bonded; constructions
H01L23/488
consisting of soldered; or bonded; constructions
H01L23/498
Leads,; i.e. metallisations or lead-frames; on insulating substrates,; e.g. chip carriers
H01L23/498
Leads,; i.e. metallisations or lead-frames; on insulating substrates,; e.g. chip carriers
H01L23/49811
Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
H01L23/49811
Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads