H01L23/52
Arrangements for conducting electric current within the device in operation from one component to another; , i.e. interconnections, e.g. wires, lead frames
H01L23/52
Arrangements for conducting electric current within the device in operation from one component to another; , i.e. interconnections, e.g. wires, lead frames
H01L23/522
including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L23/522
including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L23/5226
Via connections in a multilevel interconnection structure
H01L23/5226
Via connections in a multilevel interconnection structure