H01L23/52
Arrangements for conducting electric current within the device in operation from one component to another; , i.e. interconnections, e.g. wires, lead frames
H01L23/52
Arrangements for conducting electric current within the device in operation from one component to another; , i.e. interconnections, e.g. wires, lead frames
H01L23/522
including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L23/522
including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L23/53209
based on metals, e.g. alloys, metal silicides
H01L23/53209
based on metals, e.g. alloys, metal silicides
H01L23/53238
Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
H01L23/53238
Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers