H
ELECTRICITY
H
ELECTRICITY
H01
ELECTRIC ELEMENTS
H01
ELECTRIC ELEMENTS
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/93
Batch processes
H01L24/93
Batch processes
H01L24/95
at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
H01L24/95
at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
H01L24/97
the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
H01L24/97
the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting