H
ELECTRICITY
H
ELECTRICITY
H01
ELECTRIC ELEMENTS
H01
ELECTRIC ELEMENTS
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/15
Details of package parts other than the semiconductor or other solid state devices to be connected
H01L2924/15
Details of package parts other than the semiconductor or other solid state devices to be connected
H01L2924/151
Die mounting substrate
H01L2924/151
Die mounting substrate
H01L2924/156
Material
H01L2924/156
Material
H01L2924/157
with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
H01L2924/157
with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
H01L2924/15738
the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
H01L2924/15738
the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
H01L2924/15747
Copper [Cu] as principal constituent
H01L2924/15747
Copper [Cu] as principal constituent