Patent classifications
B32B2264/02
MULTI-LAYER THERMAL BARRIER
A multi-layer thermal barrier may be applied to a surface of components within an internal combustion engine. The multi-layer thermal barrier provides low thermal conductivity and low heat capacity insulation that is sealed against combustion gasses. The multi-layer thermal barrier includes two, three, or more layers, bonded to one another, e.g., a first (bonding) layer, a second (insulating) layer, and a third (sealing) layer. The insulating layer is disposed between the bonding layer and the sealing layer. The bonding layer is bonded to the component. The insulating layer includes hollow microstructures that may be sintered together to form insulation that provides a low effective thermal conductivity and low effective heat capacity. The sealing layer may be formed of a ceramic material, and the insulating layer may include deformed microstructures having a greater width than height.
Resin sheet
Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120 C. for 20 hours is 50 S/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160 C. for 20 hours is 200 S/cm or less, can provide a thin insulating layer having excellent insulating properties.
MULTILAYER ARTICLES WITH A BARRIER FILM INCLUDING A THERMOPLASTIC ALIPHATIC POLYESTER, A POLYVINYL ALKANOATE POLYMER, AND A PLASTICIZER
Multilayer articles include a fibrous web and a barrier film directly bonded to the fibrous web; wherein the fibrous web includes fibers that include natural fibers, synthetic fibers, or combinations thereof; wherein the synthetic fibers comprise a synthetic thermoplastic polymer selected from an aliphatic polyester, an aromatic polyester, a polyamide, and combinations thereof; and wherein the barrier film includes a thermoplastic aliphatic polyester, a polyvinyl alkanoate polymer having a Tg of no greater than 70 C; and a non-lactide plasticizer having an acid number of no greater than 10 and having a weight average molecular weight of no greater than 5000 g/mol.
Composite ballistic resistant laminate
An unconsolidated impact and penetration resistant laminate comprises a plurality of cross-plied sheets, each cross-plied sheet further comprising (i) first and second layers of fibrous or non-fibrous ultra-high molecular weight polyethylene and (ii) first and second layers of thermoplastic adhesive, each adhesive layer having a basis weight of no greater than 5 gsm, wherein (a) the layers of polyethylene and thermoplastic adhesive alternate within the sheet, (b) at least 50 percent of the polyethylene layers are arranged such that the orientation of the first polyethylene layer is offset with respect to the orientation of the second polyethylene layer, and (c) the plurality of cross-plied sheets form a stack that, when subjected to compaction at a pressure of 255 bar and a temperature of 132 degrees C., will not suffer a pressure loss greater than 8 bar within the first two minutes as measured by Test Method B.
METHOD TO PRODUCE A THERMOPLASTIC WEAR RESISTANT FOIL
A method to produce a wear resistant foil, including providing a first foil including a first thermoplastic material, applying wear resistant particles on the first foil, applying a second foil including a second thermoplastic material on the first foil, and adhering the first foil and the second foil to each other to form a wear resistant foil.
Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer
A temporary adhesive material for a wafer processing, used for temporarily bonding a support and a wafer having a circuit-forming front surface and a back surface to be processed, contains a complex temporary adhesive material layer having a three-layered structure that includes a first temporary adhesive layer composed of a non-silicone thermoplastic resin layer capable of releasably adhering to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane polymer layer laminated on the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer laminated on the second temporary adhesive layer and capable of releasably adhering to the support. A wafer processing laminate and temporary adhesive material for a wafer processing facilitate temporary adhesion and separation, have excellent CVD resistance, and can increase productivity of thin wafers, and a method manufactures a thin wafer using the same.
QUANTUM-DOT CONTAINING RESIN SHEET OR FILM, METHOD FOR PRODUCING THE SAME, AND WAVELENGTH CONVERSION MEMBER
A wavelength conversion member, for a backlight, is provided. The wavelength conversion member includes a stack of a plurality of resin layers, with at least one of the plurality of resin layers containing quantum dots. The plurality of resin layers is integrally molded through co-extrusion, and forms a three-layer structure comprising a middle layer containing the quantum dots and upper and lower layers that do not contain the quantum dots. The upper layer and the lower layer are respectively on an upper side and a lower side of the middle layer. The upper and lower layers each contain a light scattering agent. Each of the plurality of resin layers is directly joined together with a bonding layer at an interface between the middle layer and the upper layer and not at an interface between the middle layer and the lower layer.
Low density coring material
A low density coring material is described. In one embodiment, the low density coring material consists essentially of: about 40 to about 80 wt % resin; 0 to about 50 wt % monomer; 0 to about 5 wt % dispersion aid; 0 to about 5 wt % accelerator; about 3 to about 7 wt % microspheres; and about 1 to about 5 wt % catalyst; wherein a density of the cured coring material is less than about 5.0 lbs/gal. Composites made using the low density coring material and methods of making composites are also described.
Thermosetting resin composition and uses thereof
A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.
CARBON NANOTUBE SHEET STRUCTURE AND METHOD FOR ITS MAKING
A carbon nanotube (CNT) sheet containing CNTs, arranged is a randomly oriented, uniformly distributed pattern, and having a basis weight of at least 1 gsm and a relative density of less than 1.5. The CNT sheet is manufactured by applying a CNT suspension in a continuous pool over a filter material to a depth sufficient to prevent puddling of the CNT suspension upon the surface of the filter material, and drawing the dispersing liquid through the filter material to provide a uniform CNT dispersion and form the CNT sheet. The CNT sheet is useful in making CNT composite laminates and structures having utility for electro-thermal heating, electromagnetic wave absorption, lightning strike dissipation, EMI shielding, thermal interface pads, energy storage, and heat dissipation.